Manufacturer Part Number
EP2A15F672C9
Manufacturer
Intel
Introduction
Integrated Circuit (IC)
Embedded FPGA (Field Programmable Gate Array)
Product Features and Performance
672-FBGA (27x27) package
492 I/O pins
16,640 Logic Elements/Cells
425,984 Total RAM Bits
1,664 LABs/CLBs
1,900,000 Gates
Operating Temperature: 0°C to 85°C (TJ)
Supply Voltage: 1.425V to 1.575V
Product Advantages
Reconfigurable logic for flexible and customizable designs
High performance and logic density
Wide operating temperature range
Suitable for various embedded applications
Key Technical Parameters
Package: 672-BBGA
Mounting Type: Surface Mount
Series: APEX II
Quality and Safety Features
Reliable and durable construction for industrial environments
Compliance with relevant safety and quality standards
Compatibility
Suitable for a wide range of embedded applications and systems
Application Areas
Industrial control systems
Automation equipment
Communications infrastructure
Medical devices
Military and aerospace systems
Product Lifecycle
Current product offering, no plans for discontinuation
Availability of replacement and upgrade options
Key Reasons to Choose This Product
High performance and logic capacity
Flexible reconfigurability for custom designs
Wide operating temperature range for industrial use
Reliable and durable construction
Compatibility with various embedded applications
EP2A25B724C7AlteraIC FPGA 540 I/O 724BGA