Manufacturer Part Number
5CEFA2M13C8N
Manufacturer
Intel
Introduction
The 5CEFA2M13C8N is part of Intel's Cyclone® V E series, designed for high-performance embedded processing in a compact and energy-efficient package.
Product Features and Performance
Embedded FPGA configuration
Offers a total of 9434 LABs/CLBs
Contains 25000 logic elements/cells
Equipped with 2002944 total RAM bits
Provides 223 I/O pins
Operates on a voltage supply between 1.07V and 1.13V
Surface mount design
Rated for operation within a temperature range of 0°C to 85°C
Features a compact 383-TFBGA package
Compatible with a 383-MBGA (13x13) supplier device package
Product Advantages
High logic density enhances complexity capabilities
Ample memory resources manage extensive data tasks
Versatile power specifications promote energy efficiency
Broad operating temperature range ensures reliability in diverse environments
Compact form factor aids in space-sensitive applications
Key Technical Parameters
Number of LABs/CLBs: 9434
Number of Logic Elements/Cells: 25000
Total RAM Bits: 2002944
Number of I/O: 223
Voltage Supply: 1.07V ~ 1.13V
Operating Temperature: 0°C ~ 85°C
Package Type: 383-TFBGA
Quality and Safety Features
Manufactured under strict standards to ensure performance stability and safety
Temperature rating confirms operational reliability under varying thermal conditions
Compatibility
Compatible with standard surface mount technology
Alignment with 383-MBGA package specifications for ease of integration
Application Areas
Suitable for embedded system applications in telecommunications, automotive industries, and consumer electronics
Ideal for complex digital processing tasks requiring high logic and memory capacity
Product Lifecycle
Currently marked as active
Not nearing discontinuation, with continued manufacturer support and availability of upgrades
Several Key Reasons to Choose This Product
Manufactured by Intel, ensuring cutting-edge technology and reliability
High integration flexibility with extensive logic elements and I/O capabilities
Energy-efficient operation reduces operational costs
Robust temperature resilience makes it suitable for a wide range of industrial applications
Compact package size facilitates use in space-restricted applications
5CEFA27C7NAltera (Intel)