5CEFA2F23C6N - Intel

Manufacturer Part Number

5CEFA2F23C6N

Manufacturer

Intel

Introduction

Intel's 5CEFA2F23C6N is a high-performance, embedded FPGA from the Cyclone V E series, designed for efficient logic integration in embedded systems.

Product Features and Performance

25000 Logic Elements/Cells for complex digital logic

9434 LABs/CLBs for flexible logic implementation

2002944 Total RAM Bits for substantial memory capacity

224 I/O Pins for extensive external interfacing

07V ~ 1.13V Supply Voltage Range for low power operations

Surface Mount 484-BGA Package for compact hardware designs

Product Advantages

Optimized for low cost and power efficiency

Adaptive Logic Modules for increased performance and functionality

Integrated transceivers for high-speed data transfer

Supports vertical migration for design scalability

Key Technical Parameters

Number of LABs/CLBs: 9434

Number of Logic Elements/Cells: 25000

Total RAM Bits: 2002944

Number of I/O: 224

Voltage - Supply: 1.07V ~ 1.13V

Operating Temperature: 0°C ~ 85°C (TJ)

Mounting Type: Surface Mount

Package / Case: 484-BGA

Supplier Device Package: 484-FBGA (23x23)

Quality and Safety Features

Compliant with industry standards for safety and reliability

Robust thermal management for stability under operational stress

Compatibility

Compatible with various Intel development and software tools

Supports multiple configuration schemes for flexible system integration

Application Areas

Industrial control systems

Automotive electronics

Communications infrastructure

Consumer electronics

Product Lifecycle

Active product with ongoing manufacturer support

Not nearing discontinuation with options for future upgrades

Reasons to Choose This Product

Powered by Intel's industry-leading technology and reliability

High logic capacity and memory for demanding applications

Low power operation suitable for power-sensitive designs

Ample I/O options for flexible connectivity with peripherals

Cyclone V E series known for easy integration and cost-effectiveness

Supported by Intel's robust software and hardware ecosystem for development

Proven track record in a wide array of applications from industrial to consumer

Continued product lifecycle support from Intel ensures long-term usability

Ability to migrate designs vertically for future enhancement and scalability

High-grade thermal and quality specifications to ensure long-term reliability