Manufacturer Part Number
MPC8313CVRAFFB
Manufacturer
NXP Semiconductors
Introduction
PowerPC e300c3 core-based embedded microprocessor
Product Features and Performance
PowerPC e300c3 core
32-Bit bus architecture
333MHz clock speed
Supports DDR and DDR2 RAM controllers
Integrated 10/100/1000Mbps Ethernet
USB 2.0 with PHY support
Multipurpose I/O voltage support (1.8V, 2.5V, 3.3V)
Operational over a wide temperature range (-40°C to 105°C)
Surface mount 516-BBGA exposed pad package
Product Advantages
High-speed Ethernet interface for networking applications
Direct support for multiple memory types
USB connectivity for peripheral integration
Wide operating temperature suitable for industrial applications
Key Technical Parameters
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 333MHz
RAM Controllers: DDR, DDR2
Ethernet: Dual 10/100/1000Mbps
USB: One USB 2.0 interface
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C to 105°C
Quality and Safety Features
Tested and compliant with industry standards for reliability and safety
Operating temperature range ensures stable performance in harsh environments
Compatibility
Support for industry-standard memory and peripheral interfaces
Ease of integration into existing systems with support for legacy interfaces such as PCI
Application Areas
Network equipment
Industrial control systems
Embedded computing platforms
Product Lifecycle
Obsolete product status
Potential for replacement or upgrade options within the same product family
Several Key Reasons to Choose This Product
High integration reduces overall system complexity
Support for a variety of industry-standard interfaces (PCI, SPI, I2C)
Robust Ethernet connectivity optimizes networking capabilities
Extended temperature range for use in diverse environmental conditions
Embedded longevity, ensuring long-term deployment in industrial applications
Surface mount package ideal for compact and integrated system designs