MPC8313CVRADDC - NXP USA Inc.

Manufacturer Part Number

MPC8313CVRADDC

Manufacturer

NXP Semiconductors

Introduction

The MPC8313CVRADDC is part of the MPC83xx series of embedded microprocessors designed for industrial and networking applications.

Product Features and Performance

Single-core PowerPC e300c3 core processor

32-Bit bus width for efficient data handling

Operating at a speed of 267MHz for responsive performance

Dual Ethernet controllers supporting 10/100/1000Mbps speeds for robust networking capabilities

Integrated USB 2.0 with PHY for high-speed peripheral connectivity

Support for DDR and DDR2 RAM controllers enables flexibility in memory solutions

Surface mount 516-BBGA Exposed Pad package for compact PCB design

Product Advantages

Low power consumption and high integration for embedded applications

Extended operating temperature range from -40°C to 105°C suitable for harsh environments

Wide range of I/O voltages (1.8V, 2.5V, 3.3V) for compatibility with various peripherals and system designs

Key Technical Parameters

Core Processor: PowerPC e300c3

Number of Cores/Bus Width: 1 Core, 32-Bit

Speed: 267MHz

Ethernet: Dual 10/100/1000Mbps

USB: USB 2.0 + PHY

Operating Temperature: -40°C ~ 105°C

Mounting Type: Surface Mount

Package / Case: 516-BBGA Exposed Pad

Quality and Safety Features

Robust design for long-term reliability

Compliance with industry standards for quality assurance

Compatibility

Compatible with a broad range of operating systems and software typically used in embedded systems

Application Areas

Industrial automation

Networking equipment

General embedded computing

Telecommunications

Product Lifecycle

Active product status indicating current manufacture and availability

No immediate discontinuation, ensuring supply continuity for existing designs

Several Key Reasons to Choose This Product

Efficient processing capabilities with PowerPC e300c3 core

High-speed network connectivity including gigabit Ethernet options

Long-term reliability and quality assurance from NXP Semiconductors

Support for a wide range of operating temperatures for use in challenging environmental conditions

Wide peripheral integration including dual Ethernet, USB 2.0, and various other interfaces

Flexible memory interface options with DDR and DDR2 support ensuring compatibility with different memory modules

Well-suited for a range of demanding applications across industries with its robust feature set and performance profile