Manufacturer Part Number
MPC8250AVVMHBC
Manufacturer
NXP Semiconductors
Introduction
PowerPC G2 core embedded microprocessor
Product Features and Performance
PowerPC G2 architecture
Single-core 32-bit processing
266MHz clock speed
Communications co-processor
RISC Communication Processor Module (CPM)
Support for DRAM and SDRAM memory controllers
Product Advantages
Proven PowerPC architecture
Integrated communications processing
Designed for high-temperature operation
Key Technical Parameters
Speed: 266MHz
Core Processor: PowerPC G2
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM, SDRAM
Ethernet: 10/100Mbps (3)
Quality and Safety Features
Operational Temperature Range: 0°C ~ 105°C (TA)
Compatibility
3V I/O voltage compatibility
Surface mount 480-LBGA exposed pad packaging
Application Areas
Embedded systems
Communications infrastructure
Industrial control
Product Lifecycle
Obsolete status
Potential for replacement or upgrades may be limited
Several Key Reasons to Choose This Product
Stable and robust PowerPC G2 platform
Optimized for communication-based applications
Suitable for high-temperature environments
Direct support for multiple Ethernet connections
Extended compatibility with various memory types