Manufacturer Part Number
MPC8250ACVVMHBC
Manufacturer
NXP Semiconductors
Introduction
Embedded Microprocessor
Product Features and Performance
PowerPC G2 core
266 MHz operating speed
32-bit RISC architecture
Integrated communications co-processors (RISC CPM)
Supports DRAM and SDRAM memory controllers
Ethernet interfaces (10/100 Mbps, 3 ports)
Peripheral interfaces (I2C, SCC, SMC, SPI, UART, USART)
Product Advantages
High-performance embedded processing
Comprehensive communication and peripheral connectivity
Suitable for a wide range of embedded applications
Key Technical Parameters
Package: 480-LBGA Exposed Pad, Surface Mount
Operating Temperature: -40°C to 105°C
RoHS3 compliant
Quality and Safety Features
ROHS3 compliant
Reliable and robust design for industrial environments
Compatibility
Suitable for a wide range of embedded applications requiring high-performance processing, communication, and peripheral interfaces.
Application Areas
Industrial automation and control
Networking and communication equipment
Transportation systems
Medical devices
Consumer electronics
Product Lifecycle
The MPC8250 is an established product in NXP's portfolio. Replacement or upgrade options may be available, but the specific lifecycle status should be verified with the manufacturer.
Key Reasons to Choose
High-performance PowerPC G2 core
Extensive communication and peripheral capabilities
Robust design for industrial environments
RoHS3 compliance for environmental considerations
Suitable for a wide range of embedded applications