MMPF0200NPAEP - NXP USA Inc.

Manufacturer Part Number

MMPF0200NPAEP

Manufacturer

NXP Semiconductors

Introduction

The MMPF0200NPAEP is a power management integrated circuit designed to provide multiple regulated outputs tailored for converting power for i.MX6 applications.

Product Features and Performance

Integrated multiple output voltages

Supports a wide input voltage range of 2.8V to 4.5V

11 configurable outputs for system flexibility

High integration for space-constrained applications

Extended operating temperature from -40°C to 85°C

Adaptive voltage scaling for power efficiency

Seamless interfacing with i.MX series processors

Product Advantages

Designed specifically for i.MX applications, ensuring tight integration

Provides high efficiency and low standby power consumption

Space-saving with a 56-VFQFN Exposed Pad package

Robust design catering to extended temperature ranges

Key Technical Parameters

Input Voltage range: 2.8V ~ 4.5V

Number of Outputs: 11

Output Voltage: Multiple

Operating Temperature Range: -40°C ~ 85°C

Mounting Type: Surface Mount

Package/Case: 56-VFQFN Exposed Pad

Supplier Device Package: 56-HVQFN (8x8)

Quality and Safety Features

Built-in overcurrent and thermal protection

Compliance with industry quality and safety standards

Compatibility

Designed primarily for use with i.MX6 series processors

Suitable for applications requiring multiple regulated voltages

Application Areas

Power management for multimedia and processing devices

Ideal for portable and battery-powered equipment

Embedded systems and smart devices

Automotive infotainment and telematics systems

Product Lifecycle

Active status, indicating ongoing production and support

Longevity programs may offer extended availability for certain applications

Product Alerts and Notices provides updates, including discontinuation notices

Several Key Reasons to Choose This Product

Highly integrated solution for i.MX6 based systems

Robust power performance under varying conditions

Optimized for system longevity and reliability

Ease of design with application-specific configurations

Comprehensive technical support and documentation from NXP Semiconductors

Advanced packaging technology for space-saving design

Ready for challenging environments with extended temperature capabilities