MMPF0200F3AEP - NXP USA Inc.

Manufacturer Part Number

MMPF0200F3AEP

Manufacturer

NXP Semiconductors

Introduction

Multi-output power management integrated circuit designed for use with i.MX6 series processors

Product Features and Performance

Multiple voltage outputs tailored for i.MX6 applications

Supports a range of input voltages from 2.8V to 4.5V

Eleven configurable outputs for greater design flexibility

Integrated converter for efficient power conversion

Robust operating temperature range from -40°C to 85°C

Designed for surface mount technology for ease of assembly

56-VFQFN exposed pad enhances thermal performance

Product Advantages

Optimized for i.MX6 platform offering streamlined compatibility

High integration reduces external components and system complexity

Improved power efficiency extends battery life in portable devices

Small form factor due to 56-HVQFN (8x8) packaging

Key Technical Parameters

Voltage - Input: 2.8V to 4.5V

Number of Outputs: 11

Voltage - Output: Multiple

Operating Temperature: -40°C to 85°C (TA)

Mounting Type: Surface Mount

Package / Case: 56-VFQFN Exposed Pad

Supplier Device Package: 56-HVQFN (8x8)

Quality and Safety Features

Built to meet industry standard specifications for power management ICs

High-reliability design suitable for extended temperature applications

Compatibility

Specifically designed for converters used with the i.MX6 series of processors

Application Areas

Ideal for use in consumer electronics, smart devices, and industrial applications with i.MX6 processors

Product Lifecycle

Currently active product with no indication of nearing discontinuation

Replacement or upgrade paths available as newer processor generations are supported

Several Key Reasons to Choose This Product

Optimized for NXP's i.MX6 family, ensuring seamless integration

Comprehensive power solution reduces design time and complexity

Offers better power efficiency, promoting longer battery life for portable applications

Supports a wide range of operating temperatures, suitable for various environments

Compact packaging allows for smaller, more streamlined product design

Active product lifecycle status assures long-term availability and support