Manufacturer Part Number
DPLS160-7
Manufacturer
Diodes Incorporated
Introduction
Discrete Semiconductor Product
Transistors Bipolar (BJT) Single
Product Features and Performance
RoHS3 Compliant
SOT-23-3 Package
Operating Temperature: -55°C ~ 150°C (TJ)
Power Max: 300 mW
Voltage Collector Emitter Breakdown (Max): 60 V
Current Collector (Ic) (Max): 1 A
Current Collector Cutoff (Max): 100nA
Vce Saturation (Max) @ Ib, Ic: 330mV @ 100mA, 1A
Transistor Type: PNP
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Frequency Transition: 150MHz
Surface Mount Mounting Type
Product Advantages
RoHS3 Compliant
Wide Operating Temperature Range
High Power Handling Capability
High Collector Current Rating
Low Collector Cutoff Current
Low Saturation Voltage
High DC Current Gain
High Transition Frequency
Key Technical Parameters
Voltage Collector Emitter Breakdown (Max): 60 V
Current Collector (Ic) (Max): 1 A
Current Collector Cutoff (Max): 100nA
Vce Saturation (Max) @ Ib, Ic: 330mV @ 100mA, 1A
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Frequency Transition: 150MHz
Quality and Safety Features
RoHS3 Compliant
Wide Operating Temperature Range: -55°C ~ 150°C (TJ)
Compatibility
SOT-23-3 Package
Application Areas
Suitable for a wide range of electronic circuits and applications that require a high-performance PNP bipolar transistor.
Product Lifecycle
This product is an active and widely available component from Diodes Incorporated.
Several Key Reasons to Choose This Product
RoHS3 Compliant, ensuring compliance with environmental regulations.
Wide operating temperature range of -55°C to 150°C, suitable for harsh environments.
High power handling capability of up to 300 mW.
High collector current rating of 1 A, enabling high-current applications.
Low collector cutoff current of 100 nA, reducing leakage and improving efficiency.
Low saturation voltage of 330 mV, minimizing power dissipation and heat generation.
High DC current gain of 200, providing excellent amplification performance.
High transition frequency of 150 MHz, suitable for high-speed switching and RF applications.
Surface mount packaging for convenient and space-efficient assembly.