Manufacturer Part Number
TLT9255WLCXUMA1
Manufacturer
Infineon Technologies
Introduction
Interface transceiver component for CANbus systems with automotive grade qualification
Product Features and Performance
High-speed CAN transceiver
Supports data rates up to 5Mbps
Half-duplex communication capability
Extended operating temperature range from -40°C to 150°C
Surface Mount, Wettable Flank technology for reliable solder joints
Supplied in a 14-TDFN Exposed Pad package for compact designs
Product Advantages
Optimized for high-speed CAN applications
Robust thermal performance for automotive environments
Qualification to AEC-Q100 standards for automotive systems
Supports 5V supply voltage with a tolerance range for system flexibility
Integrated features for improved system reliability
Key Technical Parameters
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: Half
Data Rate: 5Mbps
Voltage - Supply: 4.75V to 5.25V
Operating Temperature: -40°C to 150°C (TJ)
Grade: Automotive
Qualification: AEC-Q100
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 14-TDFN Exposed Pad
Supplier Device Package: PG-TSON-14-3
Quality and Safety Features
AEC-Q100 automotive qualification
Designed for robustness in automotive applications
Thermal protection and over-temperature shutdown
Compatibility
Compatible with CAN protocol-based systems
Suitable for use in 5V automotive power supply environments
Application Areas
Automobile on-board networks
Industrial control systems with CAN interface
Automotive infotainment and body control modules
Product Lifecycle
Status: Active
Continual support with no current indication of discontinuation
Replacements or upgrades could become available as technology advances
Several Key Reasons to Choose This Product
Infineon's reputation for quality and reliability in automotive components
High-speed data transmission suitable for modern CANbus applications
Wide operating temperature range catering to harsh automotive environments
AEC-Q100 qualification ensuring rigorous testing and standards compliance
Wettable Flank package technology supporting enhanced quality of solder joints