Manufacturer Part Number
CY62158EV30LL-45BVXI
Manufacturer
Infineon Technologies
Introduction
High-speed 8Mbit SRAM memory chip designed for applications requiring high-performance non-volatile storage
Product Features and Performance
Volatile memory SRAM - Asynchronous
Memory size of 8Mbit organized as 1M x 8
45ns write cycle time and access time
Operates across a wide voltage range of 2.2V to 3.6V
Parallel Memory Interface
Supports a wide range of operating temperatures from -40°C to 85°C
Product Advantages
High-speed access and write cycles for rapid data processing
Flexible voltage range for varied application requirements
Robust temperature range suitability for demanding environments
MoBL® series known for low power and high speed
Key Technical Parameters
Memory Type: SRAM
Memory Size: 8Mbit
Memory Organization: 1M x 8
Voltage - Supply: 2.2V ~ 3.6V
Access Time: 45 ns
Operating Temperature: -40°C ~ 85°C
Quality and Safety Features
Designed and manufactured by Infineon, a trusted industry leader
Built to meet stringent quality and safety standards
Compatibility
Surface Mount 48-VFBGA package compatible with standard PCB assembly processes
Application Areas
Embedded systems
Communications equipment
Industrial control systems
Automotive electronics
Consumer electronics
Product Lifecycle
Product Status: Active
No current indication of discontinuation, ensures long-term availability
Potential future upgrades to higher densities or faster speeds
Several Key Reasons to Choose This Product
Fast data access and processing capabilities for time-sensitive applications
Compatibility with a wide range of electronic devices thanks to its standard package and interface
Suitable for harsh and temperature-variant environments, increasing reliability
Produced by Infineon, known for their commitment to quality and innovation
Long-term product support and availability minimizes redesign efforts for existing systems
High memory density in a compact 48-VFBGA package reduces footprint on printed circuit boards
Ideal for both low-power and high-speed applications, allowing for flexible design choices
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