Manufacturer Part Number
XCZU3EG-2SFVC784I
Manufacturer
Xilinx
Introduction
Zynq UltraScale+ MPSoC EG for embedded systems, combining MCU and FPGA with advanced processing capabilities
Product Features and Performance
MCU and FPGA architecture
154K+ Logic Cells for complex digital computations
256KB RAM for data storage
Peripherals include DMA, WDT
High-speed connectivity options: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating speeds of 533MHz, 600MHz, and 1.3GHz for versatile application scenarios
Operating Temperature range from -40°C to 100°C ensures reliability under various environmental conditions
Product Advantages
Integrated MCU and FPGA for streamlined development and deployment
High logic cell count for scalability and feature-rich implementations
Diverse set of peripherals and connectivity options
Multiprocessing capability for complex applications
Key Technical Parameters
533MHz, 600MHz, 1.3GHz Speed options
256KB RAM size
252 Number of I/O
784-BFBGA, FCBGA Package/Case
-40°C ~ 100°C Operating Temperature
Quality and Safety Features
Built to operate within a wide temperature range ensuring robust performance
Quality ensured by Xilinx's manufacturing standards
Compatibility
Works with standard development tools for Xilinx products
Support for multiple communication protocols ensures easy integration with other systems
Application Areas
Industrial automation
Medical devices
Automotive systems
Aerospace and defense systems
Telecommunications
Product Lifecycle
Active product status
Updates and replacements are available as part of the Zynq UltraScale+ MPSoC series
Several Key Reasons to Choose This Product
High integration reduces system complexity and BOM costs
Flexible and high-speed connectivity options for contemporary applications
Wide operating temperature range suitable for challenging environments
Strong manufacturer support and active product lifecycle
High-performance processing suitable for a multitude of embedded applications
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