XCZU3EG-2SFVA625I - AMD

Manufacturer Part Number

XCZU3EG-2SFVA625I

Manufacturer

Xilinx

Introduction

The XCZU3EG-2SFVA625I is a highly integrated embedded system-on-chip (SoC) from Xilinx's Zynq UltraScale+ MPSoC EG series, designed for next-generation applications requiring high performance and multi-domain scalability.

Product Features and Performance

Multi-core processor: ARM Cortex A53 and ARM Cortex-R5

FPGA functionality: UltraScale+ FPGA with 154,000+ Logic Cells

High-speed interfaces: Dual-core Cortex-A53 up to 1.3GHz, Cortex-R5 up to 600MHz, Mali-400 MP2 graphics at 667 MHz

Integrated peripherals: DMA, WDT

Connectivity options: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Operating temperature range from -40°C to 100°C

Product Advantages

High integration reduces system complexity and BOM cost

Versatile connectivity supports wide range implementations

Scalable processing with dual Cortex-A53, Cortex-R5, and Artix-7 FPGA

Key Technical Parameters

Processor cores: ARM Cortex A53, ARM Cortex R5

Operating speeds: 533MHz, 600MHz, 1.3GHz

Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Operating Temperature: -40°C to 100°C

Number of I/O: 180

Package type: 625-BFBGA, FCBGA

Quality and Safety Features

Extended temperature testing ensures reliability across diverse environments

BGA package for secure and robust board mounting

Compatibility

Supports designs requiring high-end signal processing and integrated logic, compatible with a broad range of interface and peripherals.

Application Areas

Industrial IoT

Automotive systems

Data processing

Robotics

Defense and aerospace

Product Lifecycle

The product status is marked 'Active'.

Long-term availability with no current plan or indication for discontinuation.

Several Key Reasons to Choose This Product

Offers a unified architecture that scales from a dual-core real-time processor to a multicore videocapable platform with FPGA capability.

Leading-edge embedded design security features.

Extensive integration offers high system performance while lowering power consumption.

Flexibility in design allows for updates and future scalability, ensuring long-term usability and reduced total cost of ownership.