Manufacturer Part Number
XCV300E-6FG456C
Manufacturer
Xilinx
Introduction
Xilinx Virtex®-E FPGA for high-performance applications
Product Features and Performance
High density with 1536 LABs/CLBs
Large number of Logic Elements/Cells: 6912
Extensive on-chip memory: Total RAM Bits 131072
Rich I/O count: 312
Considerable logic capacity: 411955 Gates
Fine-grain voltage supply control: 1.71V ~ 1.89V
Designed for surface mount technology
Product Advantages
Advanced FPGA technology from leading manufacturer
Capable of handling complex designs
Good thermal performance within 0°C ~ 85°C operating range
BGA package allows for efficient space utilization on PCBs
Key Technical Parameters
Number of LABs/CLBs: 1536
Number of Logic Elements/Cells: 6912
Total RAM Bits: 131072
Number of I/O: 312
Number of Gates: 411955
Voltage Supply: 1.71V ~ 1.89V
Operating Temperature: 0°C ~ 85°C (TJ)
Quality and Safety Features
Robust 456-BBGA package for secure mounting
Proven reliability in a variety of temperature conditions
Compatibility
Compatible with other devices in the Virtex®-E series
Designed for use with Xilinx development tools
Application Areas
Ideal for high-speed digital signal processing
Suitable for telecom infrastructure
Can be used in aerospace and defense systems
Applicable in industrial control and automation
Product Lifecycle
Product Status: Obsolete
Alternative solutions or upgrades should be sought as product is nearing discontinuation
Several Key Reasons to Choose This Product
Proven field performance in complex FPGA applications
Compatibility with a wide range of existing systems
Large I/O count facilitates versatile interfacing options
Substantial memory resources enable complex on-chip data management
Supported by the comprehensive Xilinx development ecosystem
