Manufacturer Part Number
XCV300E-6FG256I
Manufacturer
Xilinx
Introduction
High-density programmable logic device designed for high-performance applications
Product Features and Performance
Large number of Logic Cells: 6912
Number of LABs/CLBs: 1536
Total RAM Bits: 131072 for data storage
High I/O count: 176 input/output pins
Significant gate count: 411955 logic gates
Fine-grain technology architecture: Virtex®-E Series
Flexible logic resources for complex digital systems
Product Advantages
Provides a balance between high performance and cost
Can implement complex logic functions
Strong support for system-level integration
Key Technical Parameters
Voltage supply range: 1.71V to 1.89V for various applications
Surface Mount package type: 256-BGA for effective PCB design
Operational temperature range: -40°C to 100°C fits a range of environments
Supplier device package: 256-FBGA (17x17) for reliable installation
Quality and Safety Features
Tested for operation at extreme temperature conditions
Manufactured to meet high-quality standards of Xilinx
Compatibility
Can be integrated into existing designs with compatible voltage and mounting requirements
Application Areas
Used in a variety of high-speed digital applications including telecommunications, networking, and signal processing
Product Lifecycle
Obsolete - Manufacturer may have discontinued the product
Consult Xilinx for replacement or upgrade options
Several Key Reasons to Choose This Product
High integration capability reduces overall parts count
Robust performance suitable for industrial applications
Wide temperature range ensuring reliability in harsh conditions
Adept for mature designs not requiring the latest technology
Once ahead of its time, potentially lower cost due to obsolescence
XCV300E-7FG456IAMDIC FPGA 312 I/O 456FBGA