Manufacturer Part Number
XC7Z100-L2FFG1156I
Manufacturer
Xilinx
Introduction
High-density embedded SoC integrating a dual ARM Cortex-A9 processor with FPGA
Product Features and Performance
Dual ARM Cortex-A9 MPCore with CoreSight
Kintex-7 FPGA with 444K Logic Cells
High-Performance 800MHz operation
Extensive peripheral support with DMA, CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Advanced MCU and FPGA architecture integration
Large number of I/Os for flexible design
Product Advantages
Robust processing power with dual-core ARM processor
Versatile and high-density programmable logic
Wide temperature range endurability
Ample connectivity options for diverse applications
Key Technical Parameters
Architecture: MCU, FPGA
Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight
Operating Speed: 800MHz
RAM Size: 256KB
Number of I/O: 130
Operating Temperature Range: -40°C to 100°C
Package: 1156-bump Flip-Chip BGA
Quality and Safety Features
Operating temperature graded for industrial applications
Compatibility
Application compatibility with various peripherals and interfaces
Supports multiple communication protocols
Application Areas
Industrial automation
Medical equipment
Telecommunications
Advanced driver assistance systems
Defense and aerospace systems
Product Lifecycle
Currently Active
No indication of discontinuation
Potential future replacements or upgrades may be available
Reasons to Choose This Product
Scalable processing with integrated dual ARM cores and FPGA fabric
High-speed performance suitable for computation and processing-intensive applications
Diverse connectivity for modern embedded systems
Reliability in harsh environments with extended temperature range
Longevity in the market with active product status
Xilinx's reputation and support for development tools and resources
XC7Z7035-2FFG676IAMD Xilinx
XC7Z100-2FFG900E