Manufacturer Part Number
XC7Z100-2FFG900I
Manufacturer
Xilinx
Introduction
The XC7Z100-2FFG900I is part of the Zynq®-7000 series, an Embedded System On Chip (SoC) that combines the software programmability of an MCU with the hardware programmability of an FPGA.
Product Features and Performance
Integrates Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ technology for advanced multicore processing
Features Kintex™-7 FPGA for high-density logic cells offering 444K Logic Cells
Offers a variety of connectivity options including CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
Operates at a high-speed frequency up to 800MHz for efficient processing
Supports a wide operating temperature range from -40°C to 100°C (TJ)
Product Advantages
Combination of MCU and FPGA architecture for flexible and powerful computing
High logic cell density suitable for complex logic circuit integration
Wide range of connectivity options for versatile application use
Suitable for harsh environmental conditions given its wide operating temperature range
Key Technical Parameters
Core Processor: Dual ARM® Cortex®-A9
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG
Speed: 800MHz
Operating Temperature: -40°C ~ 100°C (TJ)
Package: 900-BBGA, FCBGA
Number of I/O: 212
Quality and Safety Features
Manufactured by Xilinx, a leader in integrated circuits for network infrastructure, ensuring high reliability and performance
Built to meet stringent quality standards
Compatibility
Compatible with a wide range of peripherals and memory interfaces, providing flexibility in system design
Application Areas
Suitable for high-performance embedded applications such as advanced automotive control systems, telecommunications, video surveillance, and complex industrial applications
Product Lifecycle
Currently marked as Active, implying ongoing manufacture and support
Future-proof with the availability of replacements or upgrades, given Xilinx's commitment to product evolution
Several Key Reasons to Choose This Product
High performance and flexibility due to the integration of Dual ARM® Cortex®-A9 cores with FPGA
Significant logic capacity with 444K Logic Cells enabling complex digital computations
Extensive connectivity options enhancing system integration and adaptability
Robust operating temperature range catering to mission-critical and industrial applications
Longevity and support from Xilinx, ensuring a dependable solution for embedded systems