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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XC3SD3400A-5FGG676C
XC3SD3400A-5FGG676C Image
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See specifications for product details.

XC3SD3400A-5FGG676C - AMD

Manufacturer Part Number
XC3SD3400A-5FGG676C
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XC3SD3400A-5FGG676C
ECAD Model
Parts Description
IC FPGA 469 I/O 676FBGA
Detailed Description
Package
676-BGA
Data sheet
XC3SD3400A-5FGG676C.pdf
RoHs Status
ROHS3 Compliant
In stock: 268

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Quantity

Specifications

XC3SD3400A-5FGG676C Tech Specifications
AMD - XC3SD3400A-5FGG676C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC3SD3400A-5FGG676C

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Voltage - Supply 1.14V ~ 1.26V  
Total RAM Bits 2322432  
Supplier Device Package 676-FBGA (27x27)  
Series Spartan®-3A DSP  
Package / Case 676-BGA  
Package Tray  
Product Attribute Attribute Value  
Operating Temperature 0°C ~ 85°C (TJ)  
Number of Logic Elements/Cells 53712  
Number of LABs/CLBs 5968  
Number of I/O 469  
Number of Gates 3400000  
Mounting Type Surface Mount  
Base Product Number XC3SD3400  

Parts Introduction

Manufacturer Part Number

XC3SD3400A-5FGG676C

Manufacturer

Xilinx

Introduction

Spartan-3A DSP FPGA, offering high performance and low power consumption

Product Features and Performance

Integrated DSP slices for efficient signal processing

Large number of logic cells and gates for complex designs

Abundant RAM bits for enhanced data storage

Multiple Input/Output ports for extensive connectivity

High-Speed DSP functionalities for advanced operations

Advanced 90nm process technology for lower power

Product Advantages

Optimal balance between performance and power consumption

Rich in features supporting a wide array of applications

Dedicated DSP slices enhance arithmetic functions efficiency

Key Technical Parameters

5968 LABs/CLBs

53712 Logic Elements/Cells

2322432 Total RAM Bits

469 Number of I/O

3400000 Gates

14V ~ 1.26V Supply Voltage Range

Surface Mount Mounting Type

0°C ~ 85°C Operating Temperature Range

Quality and Safety Features

Robust build for industrial applications

High reliability for long-term operation

Compliance with industry safety standards

Compatibility

Support for standard voltage and temperature ranges

Compatible with BGA mounting practices

Versatile I/O standards for board-level interoperability

Application Areas

Digital Signal Processing

Telecommunications

Consumer Electronics

Industrial Control Systems

Automotive applications

Networking and data communication

Product Lifecycle

Last Time Buy status

Potential need for future replacement or upgrade considerations

Key Reasons to Choose This Product

High-performance FPGA suitable for DSP applications

Complex design support with a large number of logic resources

Sufficient I/O count and memory storage capacity

Scalability in application due to extensive gate count

Reliable operation in specified temperature ranges

Backed by Xilinx's reputation and support systems

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC3SD3400A-5FGG676C

Product Attribute XC3SD3400A-5FGG676C XC3SD1800A-4CSG484C XC3SD1800A-5FGG676C XC3SD1800A-4FG676I
Part Number XC3SD3400A-5FGG676C XC3SD1800A-4CSG484C XC3SD1800A-5FGG676C XC3SD1800A-4FG676I
Manufacturer AMD AMD AMD AMD
Number of Gates 3400000 1800000 1800000 1800000
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Number of I/O 469 309 519 519
Package / Case 676-BGA 484-FBGA, CSPBGA 676-BGA 676-BGA
Series Spartan®-3A DSP Spartan®-3A DSP Spartan®-3A DSP Spartan®-3A DSP
Total RAM Bits 2322432 1548288 1548288 1548288
Supplier Device Package 676-FBGA (27x27) 484-CSPBGA (19x19) 676-FBGA (27x27) 676-FBGA (27x27)
Package Tray Tray Tray Tray
Number of Logic Elements/Cells 53712 37440 37440 37440
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V
Number of LABs/CLBs 5968 4160 4160 4160
Base Product Number XC3SD3400 XC3SD1800 XC3SD1800 XC3SD1800

XC3SD3400A-5FGG676C Datasheet PDF

Download XC3SD3400A-5FGG676C pdf datasheets and AMD documentation for XC3SD3400A-5FGG676C - AMD.

Environmental Information
Xilinx REACH211 Cert.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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XC3SD3400A-5FGG676C

AMD
32D-XC3SD3400A-5FGG676C

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