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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XC3SD3400A-4FGG676C
XC3SD3400A-4FGG676C Image
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See specifications for product details.

XC3SD3400A-4FGG676C - AMD

Manufacturer Part Number
XC3SD3400A-4FGG676C
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XC3SD3400A-4FGG676C
ECAD Model
Parts Description
IC FPGA 469 I/O 676FBGA
Detailed Description
Package
676-BGA
Data sheet
XC3SD3400A-4FGG676C.pdf
RoHs Status
ROHS3 Compliant
In stock: 326

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Quantity

Specifications

XC3SD3400A-4FGG676C Tech Specifications
AMD - XC3SD3400A-4FGG676C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC3SD3400A-4FGG676C

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Voltage - Supply 1.14V ~ 1.26V  
Total RAM Bits 2322432  
Supplier Device Package 676-FBGA (27x27)  
Series Spartan®-3A DSP  
Package / Case 676-BGA  
Package Tray  
Product Attribute Attribute Value  
Operating Temperature 0°C ~ 85°C (TJ)  
Number of Logic Elements/Cells 53712  
Number of LABs/CLBs 5968  
Number of I/O 469  
Number of Gates 3400000  
Mounting Type Surface Mount  
Base Product Number XC3SD3400  

Parts Introduction

Manufacturer Part Number

XC3SD3400A-4FGG676C

Manufacturer

Xilinx

Introduction

High-performance, DSP-optimized FPGA from Spartan-3A DSP series.

Product Features and Performance

5968 LABs/CLBs for customizable logic

53712 Logic Elements/Cells for complex designs

2322432 Total RAM Bits for high memory applications

469 available I/O pins

3400000 gate count for extensive resource availability

Product Advantages

Optimized for digital signal processing

Suitable for high-volume applications with cost-effective design

Rich in logic and memory resources to cater to complex algorithms

Key Technical Parameters

Number of LABs/CLBs: 5968

Number of Logic Elements/Cells: 53712

Total RAM Bits: 2322432

Number of I/O: 469

Number of Gates: 3400000

Voltage Supply Range: 1.14V ~ 1.26V

Quality and Safety Features

Comprehensive testing for reliable operation within specified temperature range

Adherence to industry standards for electronic components

Compatibility

Compatible with various design software and tools provided by Xilinx

Support for standard surface mount technology for integration into PCBs

Application Areas

Digital signal processing

Telecommunications

Automotive

Video processing

Consumer electronics

Product Lifecycle

Last Time Buy status

Likely nearing discontinuation with possible replacement or upgrade options available

Key Reasons to Choose This Product

Tailored for DSP-intensive applications with optimized design and resources

High-density I/O options for interfacing with multiple devices

Significant memory capacity suitable for demanding applications

Robust performance in operational temperature range of 0°C to 85°C

Part of the widely respected and supported Spartan®-3A DSP FPGA family

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC3SD3400A-4FGG676C

Product Attribute XC3SD3400A-4FGG676C XC3SD1800A-4FGG676I XC3SD3400A-4FGG676I XC3SD1800A-4CSG484I
Part Number XC3SD3400A-4FGG676C XC3SD1800A-4FGG676I XC3SD3400A-4FGG676I XC3SD1800A-4CSG484I
Manufacturer AMD AMD AMD AMD
Total RAM Bits 2322432 1548288 2322432 1548288
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Supplier Device Package 676-FBGA (27x27) 676-FBGA (27x27) 676-FBGA (27x27) 484-CSPBGA (19x19)
Number of I/O 469 519 469 309
Series Spartan®-3A DSP Spartan®-3A DSP Spartan®-3A DSP Spartan®-3A DSP
Number of Logic Elements/Cells 53712 37440 53712 37440
Base Product Number XC3SD3400 XC3SD1800 XC3SD3400 XC3SD1800
Package / Case 676-BGA 676-BGA 676-BGA 484-FBGA, CSPBGA
Operating Temperature 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Package Tray Tray Tray Tray
Number of Gates 3400000 1800000 3400000 1800000
Number of LABs/CLBs 5968 4160 5968 4160
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V

XC3SD3400A-4FGG676C Datasheet PDF

Download XC3SD3400A-4FGG676C pdf datasheets and AMD documentation for XC3SD3400A-4FGG676C - AMD.

Environmental Information
Xilinx REACH211 Cert.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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XC3SD3400A-4FGG676C

AMD
32D-XC3SD3400A-4FGG676C

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