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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XC3S250E-4FTG256I
AMD
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See specifications for product details.

XC3S250E-4FTG256I - AMD

Manufacturer Part Number
XC3S250E-4FTG256I
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XC3S250E-4FTG256I
ECAD Model
Parts Description
IC FPGA 172 I/O 256FTBGA
Detailed Description
Package
256-LBGA
Data sheet
XC3S250E-4FTG256I.pdf
RoHs Status
ROHS3 Compliant
In stock: 531

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Quantity

Specifications

XC3S250E-4FTG256I Tech Specifications
AMD - XC3S250E-4FTG256I technical specifications, attributes, parameters and parts with similar specifications to AMD - XC3S250E-4FTG256I

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Voltage - Supply 1.14V ~ 1.26V  
Total RAM Bits 221184  
Supplier Device Package 256-FTBGA (17x17)  
Series Spartan®-3E  
Package / Case 256-LBGA  
Package Tray  
Product Attribute Attribute Value  
Operating Temperature -40°C ~ 100°C (TJ)  
Number of Logic Elements/Cells 5508  
Number of LABs/CLBs 612  
Number of I/O 172  
Number of Gates 250000  
Mounting Type Surface Mount  
Base Product Number XC3S250  

Parts Introduction

Manufacturer Part Number

XC3S250E-4FTG256I

Manufacturer

Xilinx

Introduction

Embedded Field Programmable Gate Array for flexible digital circuit design

Product Features and Performance

From Spartan®-3E Series

612 LABs/CLBs for logic and routing

5508 Logic Elements/Cells enabling complex digital functions

221184 Total RAM Bits for data processing and storage

172 I/O pins for connecting peripherals

250000 system gates for digital circuit implementation

Surface Mount technology for PCB assembly

Product Advantages

Designed for high-performance computing applications

Scalable logic for tailored circuit designs

High density of I/O for interfacing flexibility

Supported by Xilinx design tools for easier development

Key Technical Parameters

14V ~ 1.26V Supply Voltage range for lower power operations

Operating Temperature from -40°C to 100°C supporting extreme environments

256-LBGA package for compact system integration

Quality and Safety Features

Designed for long-term reliability

Compliant with industry-standard quality and safety regulations

Compatibility

Support from Xilinx design software

Compatible with standard surface mount technology equipment

Interoperable with a wide range of digital components

Application Areas

Industrial

Telecommunication

Automotive

Consumer Electronics

Aerospace and Defense

Medical electronics

Product Lifecycle

Last Time Buy status, nearing discontinuation

Replacement or upgrade options may be available

Several Key Reasons to Choose This Product

Reliable performance in varying temperatures and conditions

High functionality with extensive logic cells and configurable I/O

Backed by Xilinx, a leader in programmable logic devices

Supports complex designs with lower overall system costs

Availability of development tools and community support

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC3S250E-4FTG256I

Product Attribute XC3S250E-4FTG256I XC3S200AN-4FTG256I XC3S250E-4FT256C XC3S250E-4VQ100C
Part Number XC3S250E-4FTG256I XC3S200AN-4FTG256I XC3S250E-4FT256C XC3S250E-4VQ100C
Manufacturer AMD AMD AMD AMD
Package Tray Tray Bulk Bulk
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Number of I/O 172 195 172 66
Package / Case 256-LBGA 256-LBGA 256-LBGA 100-TQFP
Base Product Number XC3S250 XC3S200 XC3S250 XC3S250
Supplier Device Package 256-FTBGA (17x17) 256-FTBGA (17x17) 256-FTBGA (17x17) 100-VQFP (14x14)
Total RAM Bits 221184 294912 221184 221184
Number of Gates 250000 200000 250000 250000
Number of Logic Elements/Cells 5508 4032 5508 5508
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V
Number of LABs/CLBs 612 448 612 612
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Series Spartan®-3E Spartan®-3AN Spartan®-3E Spartan®-3E

XC3S250E-4FTG256I Datasheet PDF

Download XC3S250E-4FTG256I pdf datasheets and AMD documentation for XC3S250E-4FTG256I - AMD.

Environmental Information
Xilinx REACH211 Cert.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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AMD

XC3S250E-4FTG256I

AMD
32D-XC3S250E-4FTG256I

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