Manufacturer Part Number
XC3S250E-4CPG132C
Manufacturer
Xilinx
Introduction
The XC3S250E-4CPG132C is part of the Spartan®-3E series of Field Programmable Gate Arrays (FPGAs) offered by Xilinx, designed for high-performance digital processing tasks.
Product Features and Performance
Contains 612 LABs/CLBs for logic implementation
Offers 5508 Logic Elements/Cells for versatile digital functions
Provides 221184 total RAM bits for data storage
Features 92 I/O pins for interfacing with other devices
Built with 250,000 Gates for complex circuit integration
Supports a supply voltage range of 1.14V ~ 1.26V for power efficiency
Surface Mount technology for compact and reliable board placement
Operates within a temperature range of 0°C to 85°C
Product Advantages
High logic density for complex circuit design within a single chip
Ample I/O capacity facilitates wide interfacing with peripherals and systems
Optimal power consumption enhances system reliability and efficiency
Robust operating temperature range suitable for varied environmental conditions
Surface mount package allows for efficient use of PCB space
Key Technical Parameters
Number of LABs/CLBs: 612
Number of Logic Elements/Cells: 5508
Total RAM Bits: 221184
Number of I/O: 92
Voltage Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C
Package: 132-CSPBGA (8x8)
Quality and Safety Features
Manufactured by Xilinx, a leader in FPGA technology
Rigorous quality control for high reliability
Complies with standard industry safety protocols
Compatibility
Versatile I/O compatibility with standard digital interfaces
Easy integration into existing and new design architectures
Application Areas
Digital signal processing
Communication systems
Industrial control
Consumer electronics
Automotive applications
Product Lifecycle
Currently in the Last Time Buy phase
Availability of replacements or upgrades should be confirmed with Xilinx for future-proofing designs
Several Key Reasons to Choose This Product
High density of logic elements and RAM supports advanced digital applications
Efficient power consumption and wide operating temperature range increase system reliability
Flexible interfacing with ample I/O options
Surface mount packaging aligns with modern, compact PCB designs
Backed by Xilinx's reputation for innovation and support in FPGA technologies
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