Manufacturer Part Number
XC3S1200E-4FGG320I
Manufacturer
Xilinx
Introduction
The XC3S1200E-4FGG320I is a part of the Spartan®-3E family of FPGAs designed for high-performance digital processing and embedded solutions, offered in a 320-BGA package.
Product Features and Performance
Embedded FPGA (Field Programmable Gate Array)
1,200,000 system gates
19,512 logic elements/cells
2,168 LABs/CLBs
516,096 total RAM bits
250 configurable I/O pins
Low voltage supply range of 1.14V to 1.26V
Supports surface mount technology
Product Advantages
High gate count enabling complex digital designs
Large number of I/O for wide interface compatibility
Low-power consumption for energy-efficient operations
Robust temperature tolerance from -40°C to 100°C suitable for various environments
Key Technical Parameters
Number of LABs/CLBs: 2168
Number of Logic Elements/Cells: 19512
Total RAM Bits: 516096
Number of I/O: 250
Voltage Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 320-BGA
Supplier Device Package: 320-FBGA (19x19)
Quality and Safety Features
Manufactured by Xilinx, a leader in FPGA technology
Stringent quality control ensuring reliable performance
Operates within industrial temperature ranges
Compatibility
Compatible with standard surface mount technology for PCB integration
Flexible I/O operation supporting various logic standards for broad device compatibility
Application Areas
Telecommunications
Industrial control systems
Consumer electronics
Automotive applications
Aerospace and defense
Product Lifecycle
Marked as Last Time Buy, indicating nearing discontinuation
Customers should plan for future purchases or consider replacements/upgrades
Several Key Reasons to Choose This Product
High-performance FPGA suitable for demanding digital applications
Broad applicability across various industries
Energy-efficient operation reducing overall power consumption
Xilinx's reputation for reliability and technological advancement
Future-proof design facilitating long-term deployment