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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XC3S1200E-4FG400C
AMD
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XC3S1200E-4FG400C - AMD

Manufacturer Part Number
XC3S1200E-4FG400C
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XC3S1200E-4FG400C
ECAD Model
Parts Description
IC FPGA 304 I/O 400FBGA
Package
400-BGA
Data sheet
XC3S1200E-4FG400C.pdf
Our certification
In stock: 198

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Specifications

XC3S1200E-4FG400C Tech Specifications
AMD - XC3S1200E-4FG400C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC3S1200E-4FG400C

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Voltage - Supply 1.14V ~ 1.26V  
Total RAM Bits 516096  
Supplier Device Package 400-FBGA (21x21)  
Series Spartan®-3E  
Package / Case 400-BGA  
Package Bulk  
Product Attribute Attribute Value  
Operating Temperature 0°C ~ 85°C (TJ)  
Number of Logic Elements/Cells 19512  
Number of LABs/CLBs 2168  
Number of I/O 304  
Number of Gates 1200000  
Mounting Type Surface Mount  
Base Product Number XC3S1200  

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Parts Introduction

Manufacturer Part Number

XC3S1200E-4FG400C

Manufacturer

Xilinx

Introduction

The XC3S1200E-4FG400C is part of the Spartan®-3E series of Field Programmable Gate Arrays designed for high-performance digital processing and embedded solutions.

Product Features and Performance

Field Programmable Gate Array (FPGA)

2168 LABs/CLBs

19512 logic elements/cells

516096 total RAM bits

304 I/O pins

2 million gates

Supports voltage range of 1.14V to 1.26V

Surface mount 400-BGA packaging

Product Advantages

High-density integration suits complex digital systems

Extensive I/O capability extends interfacing options

Ample on-chip memory enhances data management

Key Technical Parameters

Number of LABs/CLBs: 2168

Number of Logic Elements/Cells: 19512

Total RAM Bits: 516096

Number of I/O: 304

Number of Gates: 1200000

Voltage Supply: 1.14V ~ 1.26V

Quality and Safety Features

Operates reliably within a temperature range of 0°C to 85°C

BGA packaging for robust surface mounting

Compatibility

Compatible with various digital design tools and software offered by Xilinx and third-party vendors

Application Areas

Digital signal processing

Embedded systems

Voice and image processing applications

Telecommunications infrastructures

Automotive electronics

Product Lifecycle

Status: Last Time Buy

This product is nearing discontinuation with limited time for final purchases, replacements, or upgrades available

Several Key Reasons to Choose This Product

High logic density for complex circuit integration

Ample input/output capacity for versatile connectivity

Supported by Xilinx’s comprehensive development environment

Robust temperature and voltage operation ranges

Imminent product discontinuation provides last chance acquisition opportunity for existing designs

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC3S1200E-4FG400C

Product Attribute XC3S1200E-4FG400C XC3S1200E-4FGG320C XC3S1200E-4FGG400C XC3S1200E-4FGG400I
Part Number XC3S1200E-4FG400C XC3S1200E-4FGG320C XC3S1200E-4FGG400C XC3S1200E-4FGG400I
Manufacturer AMD AMD AMD AMD
Package / Case 400-BGA 320-BGA 400-BGA 400-BGA
Number of I/O 304 250 304 304
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V
Base Product Number XC3S1200 XC3S1200 XC3S1200 XC3S1200
Package Bulk Tray Tray Tray
Series Spartan®-3E Spartan®-3E Spartan®-3E Spartan®-3E
Number of LABs/CLBs 2168 2168 2168 2168
Total RAM Bits 516096 516096 516096 516096
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Number of Logic Elements/Cells 19512 19512 19512 19512
Number of Gates 1200000 1200000 1200000 1200000
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ)
Supplier Device Package 400-FBGA (21x21) 320-FBGA (19x19) 400-FBGA (21x21) 400-FBGA (21x21)

XC3S1200E-4FG400C Datasheet PDF

Download XC3S1200E-4FG400C pdf datasheets and AMD documentation for XC3S1200E-4FG400C - AMD.

Environmental Information
Xilinx REACH211 Cert.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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XC3S1200E-4FG400C

AMD
32D-XC3S1200E-4FG400C

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