Manufacturer Part Number
XC3S1000-4FTG256I
Manufacturer
Xilinx
Introduction
High-performance, low-cost FPGA designed for a wide range of applications
Product Features and Performance
Integrated 1920 LABs/CLBs for flexible logic implementation
17,280 Logic Elements/Cells for high-density designs
442,368 Total RAM Bits for effective data storage
173 I/O pins for extensive interfacing with peripheral components
Capable of implementing 1 million gates for complex logic functions
Supports 1.14V to 1.26V supply voltage for power-efficient operation
Surface Mount 256-LBGA for robust PCB design
Product Advantages
Optimized for cost-sensitive applications
Robust temperature range (-40°C to 100°C) supports extreme environments
High logic capacity suitable for various digital signal processing
Key Technical Parameters
Number of LABs/CLBs: 1920
Number of Logic Elements/Cells: 17280
Total RAM Bits: 442368
Number of I/O: 173
Number of Gates: 1000000
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C
Quality and Safety Features
Extended temperature range for reliability in harsh conditions
Lead-free and RoHS compliant
Designed to meet high safety and quality standards
Compatibility
Compatible with industry-standard EDA tools for design development
Supports multiple I/O standards for flexible design integration
Application Areas
Ideal for consumer electronics
Suitable for automotive applications
Embedded processing for industrial use
Communication infrastructure
Product Lifecycle
Last Time Buy indicating nearing discontinuation
Potential availability of replacements or upgrades should be checked with the manufacturer
Several Key Reasons to Choose This Product
Cost-effective solution for high-density logic designs
Broad compatibility and easy integration with existing systems
High reliability and support for extended temperature operation
Robust product lifecycle for long-term deployment
Low power consumption for energy-efficient designs
Strong brand reputation of Xilinx for FPGA products
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