Manufacturer Part Number
XC3S1000-4FGG456C
Manufacturer
Xilinx
Introduction
The XC3S1000-4FGG456C is a part of Xilinx's Spartan®-3 FPGA series, designed for high performance and cost-effective digital processing applications.
Product Features and Performance
Integrates 1,920 Logic Array Blocks (LABs) and 17,280 logic cells
Provides 442,368 total RAM bits for data storage
Supports up to 333 I/O pins for versatile connectivity options
Offers a 1 million gate density for complex digital circuit integration
Voltage supply ranges from 1.14V to 1.26V, catering to low-power applications
Surface mount 456-BBGA package for compact board design
Operates effectively within a 0°C to 85°C temperature range
Product Advantages
High integration capacity reduces overall system cost and complexity
Wide I/O availability enhances interface flexibility
Low operating voltage minimizes power consumption
Robust package design facilitates reliable surface mounting
Operational across a broad temperature spectrum, ensuring suitability for various environments
Key Technical Parameters
Number of LABs/CLBs: 1920
Logic Elements/Cells: 17280
Total RAM Bits: 442368
Number of I/O: 333
Gate Count: 1000000
Supply Voltage: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C
Package: 456-BBGA
Quality and Safety Features
Engineered to meet stringent quality standards for reliability
Includes features designed to protect against overvoltage and electrostatic discharge
Compatibility
Compatible with a broad range of standard design and development tools from Xilinx
Supports various programming languages and methodologies including VHDL and Verilog
Application Areas
Ideal for telecom infrastructure, automotive electronics, consumer electronics, and defense applications
Suited for complex digital signal processing, high-speed data processing, and general purpose FPGA applications
Product Lifecycle
Currently marked as Last Time Buy, indicating the phase-out stage of the product lifecycle
Users should consider planning for replacements or upgrades
Several Key Reasons to Choose This Product
High-density integration capable of supporting complex digital designs
Low power consumption ideal for energy-sensitive projects
Versatile I/O options accommodate a wide range of peripheral devices
Broad operating temperature range enhances deployment flexibility
Backed by Xilinx's reputation for quality and robust support resources
Availability of documentation and development tools simplifies the design process
XC3S1000-4FGG456C0985AMD Xilinx