Manufacturer Part Number
XC2S150-5PQ208C
Manufacturer
Xilinx
Introduction
The XC2S150-5PQ208C is part of the Spartan-II series, a family of high-performance Field Programmable Gate Arrays from Xilinx, designed for efficient and versatile digital circuit integration.
Product Features and Performance
Offers 864 logic blocks/CLBs and 3888 logic cells for customizable logic solutions.
Incorporates 49152 total RAM bits for data storage and processing.
Features 140 Input/Output pins facilitating interface with other components.
Supports a logic gate count of 150000 for complex circuit designs.
Operates efficiently across a voltage supply range of 2.375V to 2.625V.
Designed for surface mount technology, allowing for compact board designs.
Product Advantages
High integration capability facilitates the development of complex digital systems on a single chip.
Flexible I/O count and extensive memory storage suit diverse application needs.
Low voltage operation helps in reducing power consumption.
The compact 208-PQFP packaging enhances board space optimization.
Key Technical Parameters
Number of LABs/CLBs: 864
Number of Logic Elements/Cells: 3888
Total RAM Bits: 49152
Number of I/O: 140
Number of Gates: 150000
Voltage Supply: 2.375V ~ 2.625V
Operating Temperature: 0°C ~ 85°C
Quality and Safety Features
Robust operational temperature range from 0°C to 85°C ensures reliability under varying environmental conditions.
Compatibility
The 208-PQFP package complements standard surface mount processes, ensuring compatibility with a variety of board designs.
Application Areas
Suitable for telecommunications, automotive, consumer electronics, and data processing applications due to its versatile configuration and high performance.
Product Lifecycle
Currently marked as Obsolete, indicating discontinuation with limited availability of replacements or upgrades.
Several Key Reasons to Choose This Product
Obsolete status makes it an ideal choice for legacy systems maintenance.
High number of configurable logic elements enables design scalability.
Broad operating temperature range ensures performance stability in challenging environments.
Compact packaging aids in design miniaturization for space-constrained applications.
Surface mount compatibility simplifies the assembly process.
