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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XC2S150-5FGG456C
XC2S150-5FGG456C Image
Image may be representation.
See specifications for product details.

XC2S150-5FGG456C - AMD

Manufacturer Part Number
XC2S150-5FGG456C
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XC2S150-5FGG456C
ECAD Model
Parts Description
IC FPGA 260 I/O 456FBGA
Detailed Description
Package
456-BBGA
Data sheet
XC2S150-5FGG456C.pdf
RoHs Status
ROHS3 Compliant
In stock: 310

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Quantity

Specifications

XC2S150-5FGG456C Tech Specifications
AMD - XC2S150-5FGG456C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC2S150-5FGG456C

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Voltage - Supply 2.375V ~ 2.625V  
Total RAM Bits 49152  
Supplier Device Package 456-FBGA (23x23)  
Series Spartan®-II  
Package / Case 456-BBGA  
Package Tray  
Product Attribute Attribute Value  
Operating Temperature 0°C ~ 85°C (TJ)  
Number of Logic Elements/Cells 3888  
Number of LABs/CLBs 864  
Number of I/O 260  
Number of Gates 150000  
Mounting Type Surface Mount  
Base Product Number XC2S150  

Parts Introduction

Manufacturer Part Number

XC2S150-5FGG456C

Manufacturer

Xilinx

Introduction

The XC2S150-5FGG456C is part of the Spartan-II series from Xilinx, designed for optimal performance in embedded FPGA applications.

Product Features and Performance

Embedded FPGA (Field Programmable Gate Array)

Packaged in a 456-BBGA form

Compatible with surface mount technology

Supports 864 LABs/CLBs

Features 3888 logic elements/cells

Includes 49152 total RAM bits

Equipped with 260 I/Os

Operates with a voltage supply ranging from 2.375V to 2.625V

Functions within an operating temperature of 0°C to 85°C

Product Advantages

High density and functionality due to the large number of LABs/CLBs and logic elements/cells

Provides ample storage with a significant RAM bit count

Allows for versatile interfacing given the high number of I/O options

Suitable for various applications with its broad temperature range

Key Technical Parameters

Number of LABs/CLBs: 864

Number of Logic Elements/Cells: 3888

Total RAM Bits: 49152

Number of I/O: 260

Voltage Supply: 2.375V to 2.625V

Operating Temperature: 0°C to 85°C

Quality and Safety Features

Compliance with industry-standard mounting and packaging ensuring reliability

Operates effectively within specified temperature and voltage limits

Compatibility

Compatible with surface mount technology

Utilizes 456-FBGA (23x23) package for integration

Application Areas

Telecommunications

Automotive systems

Consumer electronics

Industrial controls

Product Lifecycle

Status: Last Time Buy

Availability of replacements or upgrades to be confirmed with manufacturer or authorized distributors

Several Key Reasons to Choose This Product

High logic and memory capacity ideal for complex designs

Supports thorough interfacing and connectivity options

Reliability in various environmental conditions

Suitable for a wide range of applications

Backed by Xilinx’s reputation for quality in FPGA technology

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC2S150-5FGG456C

Product Attribute XC2S150-5FGG456C XC2S150-5PQG208C XC2S150-5PQ208C XC2S15-5VQG100I
Part Number XC2S150-5FGG456C XC2S150-5PQG208C XC2S150-5PQ208C XC2S15-5VQG100I
Manufacturer AMD AMD AMD AMD
Number of Gates 150000 150000 150000 15000
Supplier Device Package 456-FBGA (23x23) 208-PQFP (28x28) 208-PQFP (28x28) 100-VQFP (14x14)
Series Spartan®-II Spartan®-II Spartan®-II Spartan®-II
Package Tray Tray Tray Tray
Number of Logic Elements/Cells 3888 3888 3888 432
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Total RAM Bits 49152 49152 49152 16384
Number of LABs/CLBs 864 864 864 96
Voltage - Supply 2.375V ~ 2.625V 2.375V ~ 2.625V 2.375V ~ 2.625V 2.375V ~ 2.625V
Base Product Number XC2S150 XC2S150 XC2S150 XC2S15
Package / Case 456-BBGA 208-BFQFP 208-BFQFP 100-TQFP
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ)
Number of I/O 260 140 140 60

XC2S150-5FGG456C Datasheet PDF

Download XC2S150-5FGG456C pdf datasheets and AMD documentation for XC2S150-5FGG456C - AMD.

Environmental Information
Xilinx REACH211 Cert.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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XC2S150-5FGG456C

AMD
32D-XC2S150-5FGG456C

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