Manufacturer Part Number
W25Q64FVDAIQ
Manufacturer
winbond-electronics
Introduction
The W25Q64FVDAIQ is a high-performance, 64Mbit Serial Flash Memory IC from Winbond. It features a wide operating voltage range of 2.7V to 3.6V and supports SPI and Quad I/O interface modes, providing fast read and write speeds up to 104MHz. The device is suitable for a variety of applications requiring non-volatile memory storage.
Product Features and Performance
64Mbit (8M x 8) FLASH memory capacity
SPI and Quad I/O interface modes
Fast clock frequency up to 104MHz
Low power consumption
Wide operating temperature range of -40°C to 85°C
50μs word program time, 3ms page program time
Reliable data retention of over 100 years
Endurance of up to 100,000 erase/write cycles
Product Advantages
High-performance and high-density non-volatile memory solution
Flexible interface options for diverse application requirements
Wide operating voltage and temperature range for versatile use
Excellent data retention and endurance characteristics
Key Reasons to Choose This Product
Industry-leading performance and reliability
Efficient power consumption for battery-powered applications
Proven track record and technical support from Winbond
Cost-effective solution for embedded memory needs
Quality and Safety Features
Rigorous quality control and testing processes
Compliance with industry safety and environmental standards
Compatibility
The W25Q64FVDAIQ is compatible with a wide range of microcontrollers and embedded systems supporting the SPI and Quad I/O interface protocols.
Application Areas
Industrial automation and control systems
Consumer electronics and IoT devices
Automotive electronics
Medical equipment
Telecommunications infrastructure
Product Lifecycle
The W25Q64FVDAIQ is an obsolete product, and Winbond may no longer manufacture this specific model. However, Winbond offers several alternative and equivalent SpiFlash® memory products that can serve as replacements. Customers are advised to contact our website's sales team for more information on available options and product lifecycle updates.