Manufacturer Part Number
W632GU6NB12I
Manufacturer
Winbond Electronics
Introduction
High-speed DRAM - DDR3L memory chip designed for advanced electronics requiring volatile memory solutions.
Product Features and Performance
2Gbit DDR3L SDRAM
Parallel memory interface
High clock frequency of 800 MHz for efficient data processing
Low write cycle time and access time (15ns and 20ns, respectively) for quick data writing and accessing
Operates within a wide range of supply voltages (1.283V ~ 1.45V)
Product Advantages
Large memory size and organization favorable for extensive data management
Improved low-voltage operation for energy-efficient design
Stable performance in harsh temperature conditions (-40°C ~ 95°C)
Key Technical Parameters
Memory technology: SDRAM DDR3L
Memory size and organization: 2Gbit, 128M x 16
Supply voltage range: 1.283V ~ 1.45V
Clock frequency: 800 MHz
Write cycles and access times: 15ns (write), 20ns (access)
Operating temperature: -40°C ~ 95°C (TC)
Quality and Safety Features
Rigorous testing for temperature tolerance and durability
Compliance with industry standards for electronic components
Compatibility
Supports a broad range of devices requiring DDR3L memory
Standard mounting type: Surface mount
Widespread compatibility due to standard package/case 96-VFBGA
Application Areas
Smartphones
Personal computers and laptops
Networking equipment
Digital electronics
Industrial control systems
Product Lifecycle
Currently in active production
Not nearing discontinuation
Availability of replacements or upgrades not specified
Several Key Reasons to Choose This Product
Trusted manufacturer with a reputation for quality
Robust performance in extreme temperatures
High-speed data transfer rate suitable for modern electronics
Energy efficiency contributes to longer battery life in portable devices
Sizeable memory capacity for complex data storage needs