Manufacturer Part Number
W632GG6MB-12
Manufacturer
Winbond Electronics
Introduction
High-capacity DDR3 SDRAM memory chip for various electronic applications.
Product Features and Performance
Volatile memory type
DDR3 SDRAM technology
2Gbit memory size
128M x 16 memory organization
Parallel memory interface
800 MHz clock frequency
20 ns access time
425V to 1.575V supply voltage range
Surface mount mounting type
96-VFBGA package
Product Advantages
High bandwidth and data rates due to DDR3 technology
Suitable for applications requiring large memory capacity
Efficient performance with fast access time
Key Technical Parameters
2Gbit memory size
800 MHz clock frequency
20 ns access time
425V to 1.575V voltage range
128M x 16 memory organization
Quality and Safety Features
Certified for operation within the 0°C to 95°C temperature range
Compatibility
Compatible with applications requiring DDR3 SDRAM technology and 96-VFBGA package type interface
Application Areas
Used in computing, telecommunications, and consumer electronics before becoming obsolete
Product Lifecycle
Obsolete status
Potential availability of replacements or upgrades subject to manufacturer's current offerings
Several Key Reasons to Choose This Product
High data transfer rate suitable for performance-intensive applications
Large memory capacity for data-intensive operations
Low latency with quick access time enhances overall system responsiveness
Robust temperature range for operation in diverse environmental conditions
Well-suited for systems and applications previously designed with this specific memory configuration
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