W25Q32JVSSIM - Winbond Electronics

Manufacturer Part Number

W25Q32JVSSIM

Manufacturer

Winbond Electronics

Introduction

The W25Q32JVSSIM is part of Winbond's SpiFlash® series, representing a 32Mbit non-volatile FLASH memory device.

Product Features and Performance

High-density 32Mbit FLASH memory

Non-volatile memory storage solution

Quad SPI, QPI, and DTR interface protocols for flexible and rapid data access

High-speed clock frequency of 133 MHz enabling fast data transfer rates

Supports standard and dual SPI operation for backward compatibility

Product Advantages

Low power consumption with a wide supply voltage range of 2.7V to 3.6V

Robust operating temperature range from -40°C to 85°C

Efficient write cycle time for word and page at 3ms

Quick access time of 6 ns enhancing device responsiveness

Key Technical Parameters

Memory Size: 32Mbit

Memory Organization: 4M x 8

Clock Frequency: 133 MHz

Write Cycle Time - Word, Page: 3ms

Access Time: 6 ns

Quality and Safety Features

Extended temperature range for reliable operation in extreme environments

Manufactured using industry-standard processes ensuring high reliability

Compatibility

SPI - Quad I/O, QPI, DTR interfaces for compatibility with various microcontrollers and processors

Mounting Type: Surface Mount making it suitable for modern PCB designs

Application Areas

Suitable for a wide array of electronic applications including

Consumer Electronics

Gaming Devices

Industrial Automation

Automotive Systems

IoT Devices

Product Lifecycle

Currently active with no indication of nearing discontinuation

Consistent availability of replacements or upgrades with base product number W25Q32

Several Key Reasons to Choose This Product

Robust non-volatile memory solution with 32Mbit capacity

High-speed data transfer with 133 MHz clock frequency

Flexible interfacing options including Quad SPI, QPI, and DTR

Durable in harsh temperature environments up to 85°C

Quick access time aiding performance-critical applications

High-level compatibility and ease of integration into various systems