W25M02GVTCIG - Winbond Electronics

Manufacturer Part Number

W25M02GVTCIG

Manufacturer

Winbond Electronics

Introduction

The Winbond W25M02GVTCIG is a high-performance, high-density 2Gbit NAND flash memory device with a Quad SPI interface. It offers a compact 24-TFBGA package and is designed for a wide range of applications, including consumer electronics, industrial automation, and embedded systems.

Product Features and Performance

2Gbit NAND flash memory capacity

Quad SPI interface with up to 104MHz clock frequency

Fast access time of 7ns

Page programming time of 700µs

Wide operating temperature range of -40°C to 85°C

Low power consumption with 2.7V to 3.6V operating voltage

Product Advantages

High-density storage capacity

Quad SPI interface for high-speed data transfer

Compact 24-TFBGA package for space-constrained designs

Wide temperature range for industrial applications

Low power operation for battery-powered devices

Key Reasons to Choose This Product

Reliable and high-performance NAND flash memory

Flexible Quad SPI interface for easy system integration

Optimized for a wide range of embedded applications

Cost-effective solution for high-density storage needs

Backed by Winbond's reputation for quality and innovation

Quality and Safety Features

Rigorous quality control and testing processes

Compliance with industry safety standards

Robust design for reliable and long-lasting operation

Compatibility

The W25M02GVTCIG is compatible with a wide range of embedded systems and microcontrollers that support the Quad SPI interface.

Application Areas

Consumer electronics

Industrial automation and control

Embedded systems

Network and communication devices

Automotive electronics

Product Lifecycle

The W25M02GVTCIG is an active product in our website's sales team's portfolio. There are no direct equivalent or alternative models available at this time. For the latest product information and availability, please contact our website's sales team.