Manufacturer Part Number
SIC471ED-T1-GE3
Manufacturer
Vishay-Siliconix
Introduction
The SIC471ED-T1-GE3 is a highly versatile and efficient step-down DC-DC switching regulator from Vishay-Siliconix's microBUCK® series, ideal for power management applications.
Product Features and Performance
Step-down (buck) topology for efficient down-conversion of voltage
Adjustable output voltage from 0.8V to 50.6V
High output current capability of 12A
Wide input voltage range from 4.5V to 55V
Supports high switching frequencies from 20kHz to 2MHz
Synchronous rectification for improved efficiency
Operates over a temperature range of -40°C to 105°C
Product Advantages
High efficiency and flexibility in voltage regulation
Capable of handling high current loads
Wide input voltage range accommodates various power sources
Fast switching capability allows for compact filtering components
Thermal management through operating temperature range
Surface mount package enables efficient use of PCB space
Key Technical Parameters
Voltage Input (Min): 4.5V
Voltage Input (Max): 55V
Voltage Output (Min/Fixed): 0.8V
Voltage Output (Max): 50.6V
Current Output: 12A
Frequency Switching: 20kHz ~ 2MHz
Operating Temperature: -40°C ~ 105°C (TA)
Package: PowerPAK® MLP55-27
Quality and Safety Features
Built-in over-temperature protection
Packaged in PowerPAK® MLP55-27 for enhanced thermal performance
Compatibility
Suitable for a wide range of DC-DC power supply applications
Compatible with surface mount technology for PCB assembly
Application Areas
Consumer Electronics
Industrial Power Supplies
Telecom and Datacom Systems
Automotive Electronic Systems
Product Lifecycle
Currently active product
No announced discontinuation, ensuring long-term availability
Several Key Reasons to Choose This Product
High efficiency reduces power loss and thermal footprint
Versatile input and output voltage ranges cater to a wide array of applications
High current output suitable for demanding power applications
Fast switching speeds allow for smaller external components, reducing overall design footprint
Robust temperature range and thermal package design ensure reliability in varied environments