TC62D722CFNG - Toshiba Semiconductor and Storage

Manufacturer Part Number

TC62D722CFNG

Manufacturer

Toshiba Semiconductor and Storage

Introduction

The TC62D722CFNG is a high-performance LED driver designed for efficient power management in lighting applications, featuring an integrated shift register and internal switches.

Product Features and Performance

Linear LED driver with shift register topology

16 output channels

Internal switch(s) integrated for better performance

Supports voltage supply from 3V to 5.5V

Maximum output voltage of 17V

Delivers up to 90mA current per output channel

Operating temperature range from -40°C to 85°C

Available in a 24-TSSOP exposed pad package for enhanced thermal dissipation

Product Advantages

High number of outputs ideal for complex LED setups

Integrated components reduce the need for external parts, simplifying design and reducing footprint

Wide operating temperature range ensures reliability in varied environmental conditions

Key Technical Parameters

Number of Outputs: 16

Voltage Supply (Min): 3V

Voltage Supply (Max): 5.5V

Voltage Output: 17V

Current Output / Channel: 90mA

Operating Temperature: -40°C ~ 85°C (TA)

Quality and Safety Features

Built with robust materials for extended product longevity

Complies with stringent industry standards for safety and performance

Compatibility

Compatible with various LED types and configurations suited for surface mount technology

Application Areas

Suitable for various LED lighting applications including commercial, residential, and industrial settings

Product Lifecycle

Currently in active production with no reported plans for discontinuation

Continued support and potential upgrades available for future integration

Several Key Reasons to Choose This Product

Versatile voltage compatibility

High current output per channel for brighter LED setups

Integrated internal switch provides enhanced control and efficiency

Resilient to extreme temperatures, ensuring performance stability

Simplified mounting due to the TSSOP package with exposed pad to aid thermal management