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HomeProductsDiscrete Semiconductor ProductsDiodes - Rectifiers - SingleCUS08F30,H3F
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CUS08F30,H3F - Toshiba Semiconductor and Storage

Manufacturer Part Number
CUS08F30,H3F
Manufacturer
TAEC Product (Toshiba Electronic Devices and Storage Corporation)
Allelco Part Number
32D-CUS08F30,H3F
ECAD Model
Parts Description
DIODE SCHOTTKY 30V 800MA USC
Package
SC-76, SOD-323
Data sheet
CUS08F30,H3F.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 673850

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Specifications

CUS08F30,H3F Tech Specifications
Toshiba Semiconductor and Storage - CUS08F30,H3F technical specifications, attributes, parameters and parts with similar specifications to Toshiba Semiconductor and Storage - CUS08F30,H3F

Product Attribute Attribute Value  
Manufacturer TAEC Product (Toshiba Electronic Devices and Storage Corporation)  
Voltage - Forward (Vf) (Max) @ If 220 mV @ 10 mA  
Voltage - DC Reverse (Vr) (Max) 30 V  
Technology Schottky  
Supplier Device Package USC  
Speed Fast Recovery =< 500ns, > 200mA (Io)  
Series -  
Package / Case SC-76, SOD-323  
Product Attribute Attribute Value  
Package Tape & Reel (TR)  
Operating Temperature - Junction 125°C (Max)  
Mounting Type Surface Mount  
Current - Reverse Leakage @ Vr 50 µA @ 30 V  
Current - Average Rectified (Io) 800mA  
Capacitance @ Vr, F 170pF @ 0V, 1MHz  
Base Product Number CUS08F30  

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status
ECCN EAR99
HTSUS

Parts Introduction

Manufacturer Part Number

CUS08F30,H3F

Manufacturer

TAEC Product (Toshiba Electronic Devices and Storage Corporation)

Introduction

Discrete Semiconductor Products

Diodes Rectifiers Single

Product Features and Performance

Fast Recovery =< 500ns, > 200mA (Io)

Reverse Leakage Current: 50 A @ 30 V

Forward Voltage: 220 mV @ 10 mA

Capacitance: 170pF @ 0V, 1MHz

Reverse Voltage: 30 V

Average Rectified Current: 800mA

Operating Temperature: 125°C (Max)

Product Advantages

High-speed operation

Low forward voltage

Small package size

Key Technical Parameters

Schottky Diode Technology

Surface Mount Packaging

Quality and Safety Features

RoHS3 Compliant

Compatibility

Suitable for a wide range of electronic applications

Application Areas

Suitable for use in power supplies, switched-mode power supplies, and other electronic circuits

Product Lifecycle

Current production model, no indication of discontinuation

Key Reasons to Choose This Product

High-speed operation for efficient power conversion

Low forward voltage for improved energy efficiency

Small package size for compact design

RoHS compliance for environmental responsibility

Suitable for a broad range of electronic applications

Parts with Similar Specifications

The three parts on the right have similar specifications to Toshiba Semiconductor and Storage CUS08F30,H3F

Product Attribute CUS08F30,H3F CUS05S40,H3F CUS10F30,H3F CUS08F30,H3F(T
Part Number CUS08F30,H3F CUS05S40,H3F CUS10F30,H3F CUS08F30,H3F(T
Manufacturer Toshiba Semiconductor and Storage Toshiba Semiconductor and Storage Toshiba Semiconductor and Storage TOSHIBA
Mounting Type Surface Mount Surface Mount Surface Mount -
Current - Average Rectified (Io) 800mA 500mA 1A -
Voltage - DC Reverse (Vr) (Max) 30 V 40 V 30 V -
Operating Temperature - Junction 125°C (Max) 125°C (Max) 125°C (Max) -
Current - Reverse Leakage @ Vr 50 µA @ 30 V 30 µA @ 10 V 50 µA @ 30 V -
Technology Schottky Schottky Schottky -
Capacitance @ Vr, F 170pF @ 0V, 1MHz 42pF @ 0V, 1MHz 170pF @ 0V, 1MHz -
Series - - - -
Voltage - Forward (Vf) (Max) @ If 220 mV @ 10 mA 350 mV @ 100 mA 500 mV @ 1 A -
Speed Fast Recovery =< 500ns, > 200mA (Io) Fast Recovery =< 500ns, > 200mA (Io) Fast Recovery =< 500ns, > 200mA (Io) -
Supplier Device Package USC USC USC -
Package / Case SC-76, SOD-323 SC-76, SOD-323 SC-76, SOD-323 -
Package Tape & Reel (TR) Tape & Reel (TR) Tape & Reel (TR) -
Base Product Number CUS08F30 CUS05S40 CUS10F30 -

CUS08F30,H3F Datasheet PDF

Download CUS08F30,H3F pdf datasheets and Toshiba Semiconductor and Storage documentation for CUS08F30,H3F - Toshiba Semiconductor and Storage.

PCN Packaging
Marking Chg 08/Feb/2016.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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CUS08F30,H3F Image

CUS08F30,H3F

Toshiba Semiconductor and Storage
32D-CUS08F30,H3F

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