Manufacturer Part Number
SI53304-B-GM
Manufacturer
skyworks-solutions
Introduction
A high-performance clock buffer and signal translation device designed for versatile applications in demanding environments.
Product Features and Performance
Integrates fanout buffer, multiplexer, and translator functionalities.
Supports multiple input and output standards: CML, HCSL, LVCMOS, LVDS, LVPECL.
Offers a high maximum frequency of 725 MHz for efficient signal processing.
Operates within a supply voltage range from 1.71V to 3.63V.
Designed for surface mount technology enhancing board-level integration.
Comes in a 32-VFQFN exposed pad package for improved thermal performance.
Product Advantages
Versatile input-output configuration supporting 2:6 ratio enhances signal distribution capabilities.
Differential I/O capability ensures signal integrity in noisy environments.
Wide operating temperature range from -40°C to 85°C provides reliability in varying environmental conditions.
Compact 32-QFN package facilitates efficient use of PCB space.
Key Technical Parameters
Number of Circuits: 1
Ratio Input:Output: 2:6
Differential Input:Output: Yes/Yes
Input Standards: CML, HCSL, LVCMOS, LVDS, LVPECL
Output Standards: CML, HCSL, LVCMOS, LVDS, LVPECL
Frequency Max: 725 MHz
Voltage Supply: 1.71V ~ 3.63V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Quality and Safety Features
Engineered to meet rigorous quality and safety standards ensuring long-term reliability.
Compatibility
Compatible with a wide range of digital signals making it suitable for diverse applications.
Application Areas
Telecommunications
Data Centers
High-speed computing
Industrial automation
Networking equipment
Product Lifecycle
Currently marked as Active, indicating ongoing manufacturing and availability. No immediate discontinuation notices, ensuring product support and availability of upgrades if necessary.
Several Key Reasons to Choose This Product
High flexibility with multiple input and output standards.
Enhanced signal integrity due to differential input and output.
Suitable for high-frequency applications up to 725 MHz.
Reliable performance across a broad temperature range.
Compact and thermally efficient package design.