Manufacturer Part Number
SI32260-C-FM1
Manufacturer
Skyworks Solutions
Introduction
The SI32260-C-FM1 is a versatile interface telecom component from Skyworks Solutions' ProSLIC® series. It integrates Subscriber Line Interface Concept (SLIC) and CODEC functionalities designed for telecommunication applications.
Product Features and Performance
· Integrated SLIC and CODEC functionality
· Supports GCI, PCM, and SPI interfaces
· Designed for efficient power management
· High performance in voice and data communication
· Stable operation within specified voltage supply range
Product Advantages
· Reduced power consumption
· Compact 60-WFQFN exposed pad package for space-sensitive applications
· Improved signal integrity and system reliability
· Easy to integrate with multiple communication protocols
Key Technical Parameters
· Function: SLIC, CODEC
· Interface: GCI, PCM, SPI
· Number of Circuits: 1
· Voltage - Supply: 3.13V ~ 3.47V
· Operating Temperature: 0°C ~ 70°C
· Mounting Type: Surface Mount
· Package / Case: 60-WFQFN Exposed Pad
Quality and Safety Features
· Compliant with international telecommunication safety standards
· Built with robust materials for longevity and resistance to environmental factors
· Ensures stable performance under rated operating conditions
Compatibility
Compatible with various telecommunications hardware that supports GCI, PCM, and SPI interfaces.
Application Areas
· Telecommunication systems
· Data transmission equipment
· VoIP systems
· Residential and commercial telephony infrastructure
Product Lifecycle
· Currently active product
· Not nearing discontinuation
· Availability of support and technical documentation available
Several Key Reasons to Choose This Product
· Optimal integration of SLIC and CODEC features into one device
· Low power consumption enhancing overall system efficiency
· Compliance with industry standards ensuring compatibility and safety
· Compact form factor facilitating easy integration into existing systems
· Reliable performance backed by Skyworks Solutions' reputation in telecom semiconductor products