Manufacturer Part Number
SI32176-B-FM
Manufacturer
skyworks-solutions
Introduction
The SI32176-B-FM, part of skyworks-solutions' ProSLIC® series, is an integrated circuit designed for telephone interface applications, functioning as a Subscriber Line Interface Concept (SLIC) and CODEC.
Product Features and Performance
Integrates SLIC and CODEC functionalities
Supports GCI, PCM, SPI interfaces for flexible communication
Designed for single-circuit operations
Operates on a 3.3V supply voltage
Compatible with a 0°C ~ 70°C operating temperature range
Surface Mount mounting type for efficient PCB design
Packaged in a 42-WFQFN Exposed Pad for optimal heat dissipation
Product Advantages
Consolidates multiple functionalities into a single chip
Supports a variety of interfaces for versatile application
Low voltage operation for energy-efficient designs
Surface Mount technology enables compact and dense board layouts
Key Technical Parameters
Voltage Supply: 3.3V
Interface: GCI, PCM, SPI
Number of Circuits: 1
Operating Temperature: 0°C ~ 70°C
Package / Case: 42-WFQFN Exposed Pad
Quality and Safety Features
Designed and manufactured by skyworks-solutions, a reputable player in the telecom industry, ensuring high-quality standards and reliability
Compatibility
Compatible with a broad range of telecommunication interfaces and protocols
Application Areas
Telecommunications infrastructure
Home and office telecom equipment
VoIP systems
Analog telephony adapters
Product Lifecycle
Marked as Obsolete, indicating it is nearing discontinuation
Potential customers should check for availability of replacements or upgrades
Several Key Reasons to Choose This Product
The integrated SLIC and CODEC functions reduce system complexity and component count
Diverse interface support enhances product versatility in different telecom applications
Low supply voltage requirement facilitates the creation of energy-efficient systems
Surface Mount packaging allows for more compact device designs
skyworks-solutions' reputation for quality and reliability minimizes risk in product development and deployment