SI3019-F-FSR - Skyworks Solutions Inc.

Manufacturer Part Number

SI3019-F-FSR

Manufacturer

Skyworks Solutions

Introduction

The SI3019-F-FSR by Skyworks Solutions is a cutting-edge interface telecom product designed for efficient direct access arrangement (DAA).

Product Features and Performance

Incorporates GCI, PCM, SPI interfaces for flexible connectivity options.

Operates efficiently with a supply voltage of 3V to 3.6V.

Low current supply requirement of 8.5mA for energy-efficient operation.

Designed for optimal performance within a temperature range of 0°C to 70°C.

Surface Mount Technology (SMT) for streamlined PCB design and manufacture.

Product Advantages

Minimized power consumption enhances device longevity and reduces energy costs.

Wide range of interfaces supports a variety of telecommunications equipment and protocols.

Suitable for operations in a broad range of environmental conditions.

Compact 16-SOIC package allows for efficient use of PCB space.

Key Technical Parameters

Supply Voltage: 3V ~ 3.6V

Current Supply: 8.5mA

Operating Temperature: 0°C ~ 70°C

Mounting Type: Surface Mount

Package: 16-SOIC (0.154", 3.90mm Width)

Quality and Safety Features

Meets stringent quality and safety standards for telecom applications.

Rigorous testing ensures reliability and durability in various operating conditions.

Compatibility

Compatible with various telecom systems through GCI, PCM, SPI interfaces.

Can be easily integrated into existing setups due to its flexible connectivity options.

Application Areas

Telecommunications equipment

Interface modules for telecom infrastructure

Direct access systems for communication networks

Product Lifecycle

The SI3019-F-FSR remains active and is not nearing discontinuation.

Continuous manufacturer support with availability of replacements or upgrades.

Several Key Reasons to Choose This Product

High reliability and performance under a wide range of environmental conditions.

Low power consumption for energy-efficient telecom solutions.

Broad interface compatibility eases integration into diverse systems.

Active product lifecycle status ensures long-term availability and support.

Compact form factor facilitates efficient use of space in device designs.