LDK130M33R - STMicroelectronics

Manufacturer Part Number

LDK130M33R

Manufacturer

STMicroelectronics

Introduction

The LDK130M33R is a low drop out (LDO) regulator designed for power-sensitive applications, offering a highly efficient and stable power supply with a fixed 3.3V output.

Product Features and Performance

Low Drop Out Voltage: 0.4V @ 300mA

Output Current: 300mA

Quiescent Current: 60 µA

Maximum Supply Current: 120 µA

Power Supply Rejection Ratio (PSRR): 55dB (120Hz ~ 10kHz)

Control Features: Enable

Protection Features: Over Current, Over Temperature

Operating Temperature Range: -40°C ~ 125°C

Automotive Grade and AEC-Q100 Qualified

Product Advantages

High-efficiency for power-sensitive applications

Minimal power loss due to low dropout voltage

Extended battery life with low quiescent current

Reliable operation with built-in protection features

Suitable for automotive applications

Key Technical Parameters

Voltage Input (Max): 5.5V

Voltage Output (Min/Fixed): 3.3V

Current Output: 300mA

Voltage Dropout (Max): 0.4V @ 300mA

Current Quiescent (Iq): 60 µA

PSRR: 55dB (120Hz ~ 10kHz)

Operating Temperature: -40°C ~ 125°C

Quality and Safety Features

Over Current and Over Temperature Protection

AEC-Q100 Qualified for automotive reliability

Compatibility

Mounting Type: Surface Mount

Package / Case: SC-74A, SOT-753

Application Areas

Power management for automotive electronics

Portable and battery-powered devices

Microcontroller power supply

IoT devices

Product Lifecycle

Status: Active

The product is not nearing discontinuation, with replacements or upgrades readily available

Several Key Reasons to Choose This Product

Superior power efficiency for prolonged battery life

Low dropout voltage ensures minimal power loss

Built-in safety features guarantee stable and reliable operation

Automotive grade qualification meets stringent quality standards

Wide operating temperature range for versatile application scenarios

Minimal quiescent current reduces idle power consumption

Straightforward integration with surface mount packaging