DF2633F25V - Renesas Electronics America Inc

Manufacturer Part Number

DF2633F25V

Manufacturer

Renesas Electronics America

Introduction

H8S/2600 Series 16-Bit High-performance Embedded Microcontroller

Product Features and Performance

16-Bit Core Processor H8S/2600

Operating Speed of 25MHz

Rich Connectivity with I2C, IrDA, SCI, SmartCard Interfaces

Provides DMA, Power-on Reset (POR), Pulse Width Modulation (PWM), Watchdog Timer (WDT) Peripherals

73 Available Input/Output Ports

FLASH Memory of 256KB (256K x 8)

16KB RAM for Data Storage (16K x 8)

Internal Analog-to-Digital Converter with 16 Channels, 10-bit Resolution

Digital-to-Analog Converter with 4 Channels, 8-bit Resolution

Internal Oscillator for System Clock Generation

Optimized for Low Voltage Operation, 3V to 3.6V

Surface Mount 128-QFP (14x20) Package for PCB Assembly

Product Advantages

High Integration Maximizes Functionality in Limited Space

Multiple Communication Interfaces for Varied Application Needs

Sufficient Data and Program Memory for Complex Applications

Optimized Power Consumption for Battery-powered Devices

Key Technical Parameters

Flash Program Memory: 256KB

RAM: 16KB

I/O Number: 73

Supply Voltage Range: 3V ~ 3.6V

Operating Temperature Range: -20°C ~ 75°C

ADC: 16-channels, 10-bit

DAC: 4-channels, 8-bit

Quality and Safety Features

Robust Industry-Standard Quality for Embedded Systems

Watchdog Timer for System Reliability

Power-on Reset to Ensure Proper Startup Conditions

Compatibility

128-QFP Surface Mount Compatible With Standard PCB Technology

Application Areas

Industrial Control Systems

Automotive Electronics

Consumer Electronics

Communication Devices

Product Lifecycle

Obsolete Status

Likely Candidates Available for Replacement or Upgrade

Several Key Reasons to Choose This Product

Robust Performance in an Industrial Standard Package

Diverse Set of Peripherals Enhancing Functionality

Excellent Data Handling and Storage Capacity to Support Complex Applications

Power-efficient Operation Suitable for Portable Devices

Wide Operating Temperature Range for various Environmental Conditions

High Level of Integration for Embedded Systems with Limited Space Constraints