83026BMI-01LF - Renesas Electronics America Inc

Manufacturer Part Number

83026BMI-01LF

Manufacturer

renesas-electronics-america

Introduction

The 83026BMI-01LF is a high-performance fanout buffer designed for clock/timing signal distribution.

Product Features and Performance

Supports a wide variety of input signals: HCSL, LVDS, LVHSTL, LVPECL, SSTL.

Outputs LVCMOS, LVTTL signals effectively.

Capable of operating at a maximum frequency of 350 MHz.

Operates with a supply voltage range of 3.135V to 3.465V.

Designed for surface mounting with an 8-SOIC packaging.

Supports a temperature range of -40°C to 85°C for varied environmental conditions.

Product Advantages

Flexible input compatibility caters to different signal requirements.

High maximum frequency supports demanding applications.

Wide operating temperature range ensures reliability under extreme conditions.

Compact SOIC packaging allows for efficient use of PCB space.

Key Technical Parameters

Number of Circuits: 1

Ratio - Input:Output: 1:2

Differential - Input:Output: Yes/No

Maximum Frequency: 350 MHz

Voltage - Supply: 3.135V ~ 3.465V

Operating Temperature: -40°C ~ 85°C

Packaging: 8-SOIC

Quality and Safety Features

The device adheres to rigorous quality and safety standards required for clock/timing buffer devices.

Compatibility

Compatible with a range of signal inputs (HCSL, LVDS, LVHSTL, LVPECL, SSTL) and capable of driving LVCMOS, LVTTL outputs.

Application Areas

Ideal for use in computing, high-performance networking, telecom infrastructure, and other advanced electronic systems requiring precise clock distribution.

Product Lifecycle

Status: Active

This product is in the active stage of its lifecycle, with no immediate indications of discontinuation. Replacement or upgrade options are readily available for future needs.

Several Key Reasons to Choose This Product

Wide input signal compatibility ensures flexibility in design.

High-frequency capability allows use in advanced, high-speed applications.

Supports demanding environmental conditions with a wide operating temperature range.

Compact and efficient packaging maximizes PCB space usage.

Active product lifecycle status ensures availability and support for future projects.