Manufacturer Part Number
553MILFT
Manufacturer
Renesas Electronics America
Introduction
The 553MILFT is part of the ClockBlocks™ series, designed for Clock/Timing Clock Buffers and Drivers applications, offering an efficient solution for signal distribution.
Product Features and Performance
Operates as a Fanout Buffer (Distribution) with a 1:4 input to output ratio.
Features CMOS input and output levels.
Supports a maximum frequency of up to 200 MHz.
Adaptable voltage supply range from 2.375V to 5.25V.
Designed for surface mount technology with an 8-SOIC package.
Wide operating temperature range from -40°C to 85°C.
Product Advantages
Flexible voltage supply compatibility enhances device interoperability.
High maximum frequency support allows for use in high-speed applications.
The surface mount package facilitates easy and compact PCB design.
Broad operating temperature range ensures reliability under extreme conditions.
Key Technical Parameters
Number of Circuits: 1
Ratio Input:Output: 1:4
Input: CMOS
Output: CMOS
Frequency Max: 200 MHz
Voltage Supply: 2.375V ~ 5.25V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC
Quality and Safety Features
Manufactured by Renesas Electronics America, a leader in semiconductor solutions, ensuring high-quality and reliability.
Compatibility
CMOS input and output compatibilities make it suitable for diverse electronic circuits.
Application Areas
Used in electronics requiring precise clock signal distribution such as computing, communications, and consumer electronics.
Product Lifecycle
The 553MILFT is currently active, suggesting that it is not nearing discontinuation and replacements or upgrades should be readily available.
Several Key Reasons to Choose This Product
High-frequency support allows optimal performance in demanding applications.
The product's compatibility with a wide range of supply voltages offers flexibility in circuit designs.
Renesas Electronics America's reputation for quality adds confidence in product reliability and performance.
The device's robust operating temperature range ensures functionality under diverse environmental conditions.
Compact and efficient packaging simplifies integration into various designs.