Manufacturer Part Number
AXT630124
Manufacturer
Panasonic
Introduction
AXT630124 is a high-density connector from Panasonic's F4S series, designed for board-to-board connections. This surface mount connector is tailored for compact and high-performance electronic devices.
Product Features and Performance
Surface Mount Technology (SMT) for robust PCB attachment.
30 contact positions with a pitch of 0.016" (0.40mm) allow for a dense interconnection.
Gold-plated center strip contacts ensure reliable conductivity.
Dual-row configuration maximizes connectivity in a small footprint.
Solder retention feature enhances the durability of solder joints.
Supports mated stacking heights of 1mm, optimizing board space.
Height above board is a low profile at 0.033" (0.84mm).
Product Advantages
Small pitch and high contact density enable miniaturization of devices.
Gold contact finish provides superior corrosion resistance and electrical conductivity.
Solder retention technology minimizes the risk of solder joint failure.
Low profile design is ideal for applications where space is at a premium.
Key Technical Parameters
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Number of Rows: 2
Mounting Type: Surface Mount
Contact Finish: Gold
Mated Stacking Heights: 1mm
Height Above Board: 0.033" (0.84mm)
Quality and Safety Features
Manufactured by Panasonic, a leader in electronic components, ensuring high quality and reliability.
Gold plating on contacts for enhanced durability and performance.
Compatibility
Designed for Rectangular Connectors Arrays, Edge Type, Mezzanine (Board to Board) applications.
Compatible with a wide range of PCB materials.
Application Areas
Suitable for use in telecommunications, computing devices, medical equipment, and compact electronic gadgets.
Product Lifecycle
Status: Active, indicating ongoing manufacture and availability.
Panasonic provides support with potential upgrades or replacements.
Several Key Reasons to Choose This Product
High-density connector solution from a reliable manufacturer.
Enables miniaturization of electronic devices without compromising performance.
Exceptional quality and performance with gold-plated contacts.
Designed for durability, with features like solder retention and low profile.
Versatile use across multiple advanced technological applications.