AXF363500 - Panasonic Electric Works

Manufacturer Part Number

AXF363500

Manufacturer

Panasonic

Introduction

Board to board mezzanine connector designed for high-density mounting.

Product Features and Performance

Socket, Center Strip Contacts

6 Positions in a 2 Row Configuration

Surface Mount Mounting Type

Solder Retention Feature Included

Gold Contact Finish for Reliable Connectivity

00µin (0.100µm) Contact Finish Thickness

Optimized Mated Stacking Heights at 0.8mm

Low Profile with a Height Above Board of 0.031" (0.80mm)

Product Advantages

High-Density Mounting Capabilities

Enhanced Durability with Gold Contacts

Consistent Signal Integrity

Low-profile Design for Compact Application Requirements

Optimized for Automated Assembly Processes

Designed for Solder Retention and Stability during Reflow

Key Technical Parameters

Number of Positions: 6

Number of Rows: 2

Pitch: Not Specified

Height Above Board: 0.031" (0.80mm)

Mated Stacking Heights: 0.8mm

Contact Finish Thickness: 4.00µin (0.100µm)

Quality and Safety Features

Complies with industry-standard certifications

Manufactured by Panasonic, a trusted electronics company

Robust Construction for long-term reliability

Compatibility

Compatible with various board to board interfaces in electronics

Matches with complementary connectors from Panasonic's B01 series

Application Areas

Consumer Electronics

Communication Systems

Medical Devices

Data/Computing

Industrial Applications

Product Lifecycle

Active Status; Not Nearing Discontinuation

Continued availability of replacements and upgrades

Key Reasons to Choose This Product

Manufactured by Reputable Company (Panasonic)

High-Performance Attributes for Signal Integrity

Durability with Gold Contact Finish

Suitability for Compact and High-Density Applications

Compatibility with Standard Surface Mount Technology (SMT)

Robust Design with Solder Retention for Process Stability