Manufacturer Part Number
LQW18AN4N3C00D
Manufacturer
murata-electronics
Introduction
LQW18AN4N3C00D from Murata Electronics is a surface mount, drum core, wirewound fixed inductor in the LQW18 series designed for a wide range of applications.
Product Features and Performance
Drum Core, Wirewound structure
Non-Magnetic core material
Inductance value of 4.3 nH with a tolerance of ±0.2nH
850 mA current rating
Unshielded with 59mOhm max DC resistance
High Q factor of 35 at 250MHz
Self-resonant frequency of 6GHz
Operating temperature range from -55°C to 125°C
Product Advantages
High precision inductance due to tight tolerance
Capable of handling high current applications
Excellent RF performance due to high Q factor
Suitable for high-frequency applications up to 6GHz
Robust temperature performance for wide application use
Key Technical Parameters
Inductance: 4.3 nH
Tolerance: ±0.2nH
Current Rating: 850 mA
DC Resistance: 59mOhm Max
Q @ Freq: 35 @ 250MHz
Frequency Self Resonant: 6GHz
Operating Temperature: -55°C ~ 125°C
Package: 0603 (1608 Metric)
Size/Dimension: 0.063" L x 0.031" W x 0.039" H
Quality and Safety Features
The high-quality materials and construction ensure reliable performance under varying conditions.
Compatibility
Compatible with surface mount technology, facilitating integration into a wide range of electronic circuits.
Application Areas
RF and Wireless Communications
High Frequency Digital Signal Processing
Consumer Electronics
Automotive Systems
Medical Devices
Product Lifecycle
Currently active with no immediate sign of discontinuation, ensuring availability for future designs and applications.
Several Key Reasons to Choose This Product
Exceptionally high-frequency performance suitable for RF applications.
Tight tolerance ensures precise inductance for sensitive circuits.
Robust for a wide range of temperatures, making it versatile for various environments.
High current rating within a compact 0603 package size, offering efficiency in space-constrained applications.
Unshielded design allows for tighter packing density on PCBs.
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