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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)APA150-BGG456
APA150-BGG456 Image
Image may be representation.
See specifications for product details.

APA150-BGG456 - Microsemi Corporation

Manufacturer Part Number
APA150-BGG456
Manufacturer
Microsemi
Allelco Part Number
32D-APA150-BGG456
ECAD Model
Parts Description
IC FPGA 242 I/O 456BGA
Detailed Description
Package
456-BBGA
Data sheet
ProASIC-PLUS Flash.pdf
In stock: 15120

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Quantity

Specifications

APA150-BGG456 Tech Specifications
Microsemi Corporation - APA150-BGG456 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation - APA150-BGG456

Product Attribute Attribute Value  
Manufacturer Microsemi  
Voltage - Supply 2.3V ~ 2.7V  
Total RAM Bits 36864  
Supplier Device Package 456-PBGA (35x35)  
Series ProASICPLUS  
Package / Case 456-BBGA  
Product Attribute Attribute Value  
Package Tray  
Operating Temperature 0°C ~ 70°C (TA)  
Number of I/O 242  
Number of Gates 150000  
Mounting Type Surface Mount  
Base Product Number APA150  

Parts Introduction

Manufacturer Part Number

APA150-BGG456

Manufacturer

microsemi

Introduction

The APA150-BGG456 is an embedded FPGA from microsemi's ProASICPLUS series, designed for advanced system-level integration.

Product Features and Performance

High logic gate density with 150,000 gates

Extensive memory resources with 36,864 RAM bits

Expansive I/O options with 242 input/output points

Supports a supply voltage range between 2.3V and 2.7V

Operates within a temperature range of 0°C to 70°C

Product Advantages

High gate count for complex logic applications

Robust memory capabilities for data-intensive operations

Flexible I/O for versatile connections in embedded systems

Key Technical Parameters

Number of Gates: 150000

Total RAM Bits: 36864

Number of I/O: 242

Voltage Supply: 2.3V ~ 2.7V

Operating Temperature: 0°C ~ 70°C (TA)

Quality and Safety Features

Surface mount technology enhances reliability during the board's assembly process

Operates effectively within the standard industrial temperature range

Compatibility

Designed for surface mounting using the 456-PBGA (35x35) package

Easily integrates into various electronic assembly processes

Application Areas

Ideal for usage in telecommunications, industrial control systems, and consumer electronics that require high-density FPGA integration

Product Lifecycle

Currently listed as Obsolete

Contact microsemi for potential replacement or upgrade options

Several Key Reasons to Choose This Product

Exceptional gate density for handling complex algorithms and processes

Ample RAM and extensive I/O support enhance functional versatility

Reliable performance ensured by stringent quality and safety standards

Obsolescence support with suggestions for alternates or upgrades ensuring system longevity and scalability

Suitable across diverse applications demanding high-density FPGA integration with robust environmental tolerance and operational flexibility.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microsemi Corporation APA150-BGG456

Product Attribute APA150-BGG456 APA150-FG256I APA1000-PQG208I APA150-PQ208I
Part Number APA150-BGG456 APA150-FG256I APA1000-PQG208I APA150-PQ208I
Manufacturer Microsemi Corporation Microchip Technology Microchip Technology Microchip Technology
Supplier Device Package 456-PBGA (35x35) 256-FPBGA (17x17) 208-PQFP (28x28) 208-PQFP (28x28)
Voltage - Supply 2.3V ~ 2.7V 2.3V ~ 2.7V 2.3V ~ 2.7V 2.3V ~ 2.7V
Number of Gates 150000 150000 1000000 150000
Package Tray Tray Tray Tray
Base Product Number APA150 APA150 APA1000 APA150
Total RAM Bits 36864 36864 202752 36864
Operating Temperature 0°C ~ 70°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Number of I/O 242 186 158 158
Package / Case 456-BBGA 256-LBGA 208-BFQFP 208-BFQFP
Series ProASICPLUS ProASICPLUS ProASICPLUS ProASICPLUS

APA150-BGG456 Datasheet PDF

Download APA150-BGG456 pdf datasheets and Microsemi Corporation documentation for APA150-BGG456 - Microsemi Corporation.

HTML Datasheet
ProASIC-PLUS Flash.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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APA150-BGG456 Image

APA150-BGG456

Microsemi Corporation
32D-APA150-BGG456

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