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HomeProductsIntegrated Circuits (ICs)Embedded - System On Chip (SoC)A2F060M3E-FGG256
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A2F060M3E-FGG256 - Microsemi Corporation

Manufacturer Part Number
A2F060M3E-FGG256
Manufacturer
Microsemi
Allelco Part Number
32D-A2F060M3E-FGG256
ECAD Model
Parts Description
IC SOC CORTEX-M3 80MHZ 256FBGA
Package
256-LBGA
Data sheet
SmartFusion cSoC Datasheet.pdf
Our certification
In stock: 10320

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Specifications

A2F060M3E-FGG256 Tech Specifications
Microsemi Corporation - A2F060M3E-FGG256 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation - A2F060M3E-FGG256

Product Attribute Attribute Value  
Manufacturer Microsemi  
Supplier Device Package 256-FPBGA (17x17)  
Speed 80MHz  
Series SmartFusion®  
RAM Size 16KB  
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops  
Peripherals DMA, POR, WDT  
Package / Case 256-LBGA  
Product Attribute Attribute Value  
Package Tray  
Operating Temperature 0°C ~ 85°C (TJ)  
Number of I/O MCU - 26, FPGA - 66  
Flash Size 128KB  
Core Processor ARM® Cortex®-M3  
Connectivity EBI/EMI, I²C, SPI, UART/USART  
Base Product Number A2F060M3E  
Architecture MCU, FPGA  

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Parts Introduction

Manufacturer Part Number

A2F060M3E-FGG256

Manufacturer

Microsemi

Introduction

The A2F060M3E-FGG256 is a member of Microsemi's SmartFusion® family of Embedded System on Chip (SoC) devices. It combines a powerful ARM® Cortex®-M3 MCU, a flash-based FPGA fabric, and a comprehensive set of analog and digital peripherals, making it a highly integrated and versatile solution for a wide range of embedded applications.

Product Features and Performance

ARM Cortex-M3 core operating up to 80MHz

128KB of embedded Flash memory and 16KB of RAM

Comprehensive peripheral set including DMA, POR, and WDT

Rich connectivity options including EBI/EMI, I2C, SPI, and UART/USART

ProASIC3 FPGA fabric with 60K gates and 1536 D-Flip-Flops

Operating temperature range of 0°C to 85°C (TJ)

256-LBGA package with 66 FPGA I/Os and 26 MCU I/Os

Product Advantages

Highly integrated SoC solution with both MCU and FPGA capabilities

Flexible and configurable design to meet diverse application requirements

Low power consumption and wide operating temperature range

Comprehensive peripheral set and connectivity options

Key Reasons to Choose This Product

Versatile and customizable platform for a wide range of embedded applications

Powerful combination of ARM Cortex-M3 MCU and flash-based FPGA fabric

Robust set of features and peripherals to simplify system design

Proven reliability and performance of Microsemi's SmartFusion technology

Quality and Safety Features

Rigorous quality control and testing processes

Compliance with industry safety and regulatory standards

Compatibility

The A2F060M3E-FGG256 is compatible with other devices in the SmartFusion® family and can be used in a variety of embedded applications.

Application Areas

Industrial automation and control

Medical equipment

Transportation systems

Defense and aerospace applications

General-purpose embedded systems

Product Lifecycle

The A2F060M3E-FGG256 is an obsolete product, and Microsemi no longer manufactures it. However, there are several alternative and equivalent models available in the SmartFusion® family, such as the A2F200M3F-FGG256 and the A2F500M3F-FGG676. Please contact our website's sales team for more information on these alternative options or to discuss your specific requirements.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microsemi Corporation A2F060M3E-FGG256

Product Attribute A2F060M3E-FGG256 A2F200M3F-1FGG484I A2F200M3F-FGG256I A2F200M3F-FG256I
Part Number A2F060M3E-FGG256 A2F200M3F-1FGG484I A2F200M3F-FGG256I A2F200M3F-FG256I
Manufacturer Microsemi Corporation Microchip Technology Microchip Technology Microchip Technology
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3
Package Tray Tray Tray Tray
Peripherals DMA, POR, WDT DMA, POR, WDT DMA, POR, WDT DMA, POR, WDT
Flash Size 128KB 256KB 256KB 256KB
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
RAM Size 16KB 64KB 64KB 64KB
Series SmartFusion® SmartFusion® SmartFusion® SmartFusion®
Speed 80MHz 100MHz 80MHz 80MHz
Connectivity EBI/EMI, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART
Supplier Device Package 256-FPBGA (17x17) 484-FPBGA (23x23) 256-FPBGA (17x17) 256-FPBGA (17x17)
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Number of I/O MCU - 26, FPGA - 66 MCU - 41, FPGA - 94 MCU - 25, FPGA - 66 MCU - 25, FPGA - 66
Package / Case 256-LBGA 484-BGA 256-LBGA 256-LBGA
Operating Temperature 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Base Product Number A2F060M3E A2F200 A2F200 A2F200

A2F060M3E-FGG256 Datasheet PDF

Download A2F060M3E-FGG256 pdf datasheets and Microsemi Corporation documentation for A2F060M3E-FGG256 - Microsemi Corporation.

Datasheets
SmartFusion cSoC Datasheet.pdf
PCN Design/Specification
Mult Dev Design Advisory 13/Oct/2017.pdf A2FYYY 07/Nov/2016.pdf
PCN Other
Logistics 16/Nov/2016.pdf
PCN Obsolescence/ EOL
EOL Notice 04/Apr/2017.pdf Mult Devices 04/Apr/2017.pdf
PCN Assembly/Origin
Mult Dev Test Site 28/Feb/2019.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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A2F060M3E-FGG256

Microsemi Corporation
32D-A2F060M3E-FGG256

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