USB3320C-EZK-TR - Microchip Technology

Manufacturer Part Number

USB3320C-EZK-TR

Manufacturer

Microchip Technology

Introduction

The USB3320 is a high-speed USB 2.0 transceiver from Microchip Technology's innovative flexPWR series, designed for easy integration into various digital applications.

Product Features and Performance

Single-chip USB 2.0 transceiver

Fully compliant with USB 2.0 specifications

Supports high-speed (480Mbps) and full-speed (12Mbps) operations

1 Driver/1 Receiver configuration

Half-duplex data communication

Integrated receiver with 50 mV hysteresis

Operates across a voltage range of 1.8V to 3.3V

Adaptable power management support

Robust Electrostatic Discharge (ESD) protection

Product Advantages

Low-power consumption in operation and suspend modes

Programmable charge pump for flexible voltage supply management

Enhanced signal integrity with reduced electromagnetic interference

Small package design suitable for portable applications

Industrial temperature range support from -40°C to 85°C

Key Technical Parameters

Protocol: USB 2.0

Number of Drivers/Receivers: 1/1

Receiver Hysteresis: 50 mV

Voltage - Supply: 1.8V ~ 3.3V

Operating Temperature: -40°C ~ 85°C

Surface Mount mounting type

32-VFQFN Exposed Pad package

Quality and Safety Features

High ESD protection level

Compliance with industry standards for safety and quality

Compatibility

Compatible with USB 2.0 high-speed and full-speed data rates

Supports various USB topologies and configurations

Application Areas

Consumer Electronics

Telecommunication Devices

Computing Peripherals

Portable Battery-powered Devices

Networking Hardware

Product Lifecycle

Active status indication

No immediate indication of nearing discontinuation

Long production lifecycle with potential for future updates and upgrades

Several Key Reasons to Choose This Product

Supports a broad range of USB applications with high-speed USB 2.0 connectivity

Flexibility in power management which can lead to extended battery life in portable devices

Industrially rated for harsh environments, increasing reliability

Compact 32-QFN package suitable for space-constrained designs

High level of integration results in reduced external component count, saving on BoM costs

Industry-leading ESD protection enhances robustness and longevity in the field

Active product lifecycle status ensures long-term availability and support